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William Tze-You Chen

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  • Endicott, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Overmolded optical package
    • Patent number 7,199,438
    • Issue date Apr 3, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Bernd Karl Appelt
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Under-bump-metallurgy layer for improving adhesion
    • Patent number 6,891,274
    • Issue date May 10, 2005
    • Advanced Semiconductor Engineering, Inc.
    • William Tze-You Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump and fabricating process thereof
    • Patent number 6,864,168
    • Issue date Mar 8, 2005
    • Advanced Semiconductor Engineering, Inc.
    • William Tze-You Chen
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    UNDER-BUMP-METALLURGY LAYER FOR IMPROVING ADHESION
    • Publication number 20040113273
    • Publication date Jun 17, 2004
    • William Tze-You Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    [BUMP AND FABRICATING PROCESS THEREOF]
    • Publication number 20040113272
    • Publication date Jun 17, 2004
    • WILLIAM TZE-YOU CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    [UNDER-BALL-METALLURGY LAYER]
    • Publication number 20040104484
    • Publication date Jun 3, 2004
    • William Tze-You Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    [SOLDER BUMP]
    • Publication number 20040065949
    • Publication date Apr 8, 2004
    • William Tze-You Chen
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...