William Uy

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic encapsulation through stencil printing
- Patent number 12,156,356
- Issue date Nov 26, 2024
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Testing system for flexible sample in electronics having a retracta...
- Patent number 11,493,414
- Issue date Nov 8, 2022
- Flex Ltd.
- Weifeng Liu
- G01 - MEASURING TESTING
Information Patent Grant
Stress relief encapsulation for flexible hybrid electronics
- Patent number 11,470,717
- Issue date Oct 11, 2022
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, devices, and systems for electronic device molding and enc...
- Patent number 11,289,393
- Issue date Mar 29, 2022
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronics encapsulation through hotmelt lamination
- Patent number 11,064,613
- Issue date Jul 13, 2021
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrating biosensor to compression shirt textile and interconnect...
- Patent number 10,993,635
- Issue date May 4, 2021
- Flextronics AP, LLC
- William Uy
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Stress relief encapsulation for flexible hybrid electronics
- Patent number 10,999,926
- Issue date May 4, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric with woven wire braid
- Patent number 10,687,421
- Issue date Jun 16, 2020
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection of multilayer printed conductive ink through filled micr...
- Patent number 10,653,010
- Issue date May 12, 2020
- Flex Ltd.
- Weifeng Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electroluminescent display on smart textile and interconnect methods
- Patent number 10,575,381
- Issue date Feb 25, 2020
- Flex Ltd.
- William Uy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible and stretchable chain battery
- Patent number 10,535,845
- Issue date Jan 14, 2020
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMT DIMM connector auto safe remove nozzle
- Patent number 9,894,820
- Issue date Feb 13, 2018
- Flextronics AP, LLC
- Virgilio Encabo Bautista
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INDUSTRIAL INTERNET OF THINGS (IIOT) IN-SITU STRESS REAL-TIME MONIT...
- Publication number 20230049986
- Publication date Feb 16, 2023
- Flex Ltd.
- Rodimir N. Vilale
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONICS BENDING FIXTURE DESIGN
- Publication number 20220018746
- Publication date Jan 20, 2022
- Flex Ltd.
- Weifeng Liu
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING
- Publication number 20210321524
- Publication date Oct 14, 2021
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENC...
- Publication number 20210193543
- Publication date Jun 24, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS
- Publication number 20210176857
- Publication date Jun 10, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ELECTRONIC COMPONENTS TO PRINTED CONDUCTIVE INK
- Publication number 20210076496
- Publication date Mar 11, 2021
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS
- Publication number 20200404780
- Publication date Dec 24, 2020
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS ENCAPSULATION THROUGH HOTMELT LAMINATION
- Publication number 20200344891
- Publication date Oct 29, 2020
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Person

Patents Grantslast 30 patents

Electronic encapsulation through stencil printing

Testing system for flexible sample in electronics having a retracta...

Stress relief encapsulation for flexible hybrid electronics

Methods, devices, and systems for electronic device molding and enc...

Electronics encapsulation through hotmelt lamination

Integrating biosensor to compression shirt textile and interconnect...

Stress relief encapsulation for flexible hybrid electronics

Fabric with woven wire braid

Connection of multilayer printed conductive ink through filled micr...

Electroluminescent display on smart textile and interconnect methods

Flexible and stretchable chain battery

SMT DIMM connector auto safe remove nozzle

Patents Applicationslast 30 patents

INDUSTRIAL INTERNET OF THINGS (IIOT) IN-SITU STRESS REAL-TIME MONIT...

ELECTRONICS BENDING FIXTURE DESIGN

ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING

METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENC...

STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS

SOLDER ELECTRONIC COMPONENTS TO PRINTED CONDUCTIVE INK

STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS

ELECTRONICS ENCAPSULATION THROUGH HOTMELT LAMINATION