Membership
Tour
Register
Log in
William W. Chen
Follow
Person
Los Angeles, CA, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Chip assembly with frequency extending device
Patent number
8,525,313
Issue date
Sep 3, 2013
Semtech Corporation
Binneg Y. Lao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for a chip assembly including a frequency exte...
Patent number
8,159,052
Issue date
Apr 17, 2012
Semtech Corporation
Binneg Y. Lao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single and multiple layer packaging of high-speed/high-density ICs
Patent number
6,803,252
Issue date
Oct 12, 2004
Sierra Monolithics, Inc.
Binneg Y. Lao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of treating a zinc sulfide body formed by chemical vapor dep...
Patent number
6,045,728
Issue date
Apr 4, 2000
Raytheon Company
William W. Chen
G02 - OPTICS
Information
Patent Grant
Bonded sapphire, and method of making same
Patent number
5,942,343
Issue date
Aug 24, 1999
Raytheon Company
William W. Chen
C30 - CRYSTAL GROWTH
Information
Patent Grant
Methods of fabricating continuous transverse stub radiating structu...
Patent number
5,771,567
Issue date
Jun 30, 1998
Raytheon Company
Brian M. Pierce
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information
Patent Grant
Method of making thermal shock resistant sapphire for IR windows an...
Patent number
5,702,654
Issue date
Dec 30, 1997
Hughes Electronics
William W. Chen
C30 - CRYSTAL GROWTH
Patents Applications
last 30 patents
Information
Patent Application
CHIP ASSEMBLY WITH FREQUENCY EXTENDING DEVICE
Publication number
20120168928
Publication date
Jul 5, 2012
SEMTECH CORPORATION
Binneg Y. LAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR A CHIP ASSEMBLY INCLUDING A FREQUENCY EXTE...
Publication number
20090256266
Publication date
Oct 15, 2009
Sierra Monolithics, Inc.
Binneg Y. LAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Connection package for high-speed integrated circuit
Publication number
20030095014
Publication date
May 22, 2003
Binneg Y. Lao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Single and multiple layer packaging of high-speed/high-density ICs
Publication number
20030096447
Publication date
May 22, 2003
Binneg Y. Lao
H01 - BASIC ELECTRIC ELEMENTS