William Weilun Hong

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
CMP system and method of use
- Patent number 11,984,323
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
Hard mask removal method
- Patent number 11,854,821
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-CMP cleaning composition for germanium-containing substrate
- Patent number 11,718,812
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ji Cui
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Hotspot avoidance method of manufacturing integrated circuits
- Patent number 11,675,953
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Shuo Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 11,637,021
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Hotspot avoidance method for manufacturing integrated circuits
- Patent number 11,443,095
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Shuo Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chemical mechanical planarization using nano-abrasive slurry
- Patent number 11,189,497
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias with metal caps for underlying conductive lines
- Patent number 11,133,247
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry and CMP method
- Patent number 11,094,555
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP system and method of use
- Patent number 11,069,533
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chien Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 11,037,799
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Hard mask removal method
- Patent number 10,971,370
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry and CMP method
- Patent number 10,692,732
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization control in semiconductor manufacturing process
- Patent number 10,541,139
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing scratch defects in chemical mechanical planari...
- Patent number 10,522,365
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask removal method
- Patent number 10,510,552
- Issue date Dec 17, 2019
- TAIWAN SEMICONDUCTOR MANFACTURING COMPANY, LTD.
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped poly-silicon for PolyCMP planarity improvement
- Patent number 10,068,988
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask removal method
- Patent number 9,960,050
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment in a chemical mechanical process
- Patent number 9,941,109
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetric application of pressure to a wafer during a CMP process
- Patent number 9,922,837
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped poly-silicon for polyCMP planarity improvement
- Patent number 9,871,115
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for semiconductor planarization
- Patent number 9,721,831
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming oxide layer over exposed polysilicon during...
- Patent number 9,711,374
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite structure for gate level inter-layer dielectric
- Patent number 9,595,450
- Issue date Mar 14, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry particle breakup
- Patent number 9,278,423
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing process with reduced defects in a cop...
- Patent number 6,946,397
- Issue date Sep 20, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...
- Publication number 20240387187
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOTSPOT AVOIDANCE METHOD OF MANUFACTURING INTEGRATED CIRCUITS
- Publication number 20240378362
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Shuo Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CMP System and Method of Use
- Publication number 20240274440
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
Hard Mask Removal Method
- Publication number 20240105460
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...
- Publication number 20230377898
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hotspot Avoidance Method of Manufacturing Integrated Circuits
- Publication number 20230267264
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Shuo Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL HETEROJUNCTION STRUCTURE WITH CAPPING METAL LAYER
- Publication number 20230230846
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng LIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Hotspot Avoidance Method of Manufacturing Integrated Circuits
- Publication number 20220382947
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Shuo Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Hotspot Avoidance Method for Manufacturing Integrated Circuits
- Publication number 20220012400
- Publication date Jan 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Shuo Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POST-CMP CLEANING COMPOSITION FOR GERMANIUM- CONTAINING SUBSTRATE
- Publication number 20210371774
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ji CUI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
CMP System and Method of Use
- Publication number 20210343538
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
METAL HETEROJUNCTION STRUCTURE WITH CAPPING METAL LAYER
- Publication number 20210272818
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng LIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Hard Mask Removal Method
- Publication number 20210225657
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP System and Method of Use
- Publication number 20210020449
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION USING NANO-ABRASIVE SLURRY
- Publication number 20200365413
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SLURRY AND CMP METHOD
- Publication number 20200279751
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Reducing Scratch Defects in Chemical Mechanical Planari...
- Publication number 20200126803
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hard Mask Removal Method
- Publication number 20200118827
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH METAL CAPS FOR UNDERLYING CONDUCTIVE LINES
- Publication number 20200105668
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL HETEROJUNCTION STRUCTURE WITH CAPPING METAL LAYER
- Publication number 20200098591
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP SLURRY AND CMP METHOD
- Publication number 20200098590
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Hard Mask Removal Method
- Publication number 20180240679
- Publication date Aug 23, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- CHE-HAO TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED POLY-SILICON FOR POLYCMP PLANARITY IMPROVEMENT
- Publication number 20180145152
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment in a Chemical Mechanical Process
- Publication number 20180005840
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doped Poly-Silicon for PolyCMP Planarity Improvement
- Publication number 20180006134
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Weilun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarization Control in Semiconductor Manufacturing Process
- Publication number 20170278712
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Application of Pressure to a Wafer During a CMP Process
- Publication number 20170256414
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Reducing Scratch Defects in Chemical Mechanical Planari...
- Publication number 20170213743
- Publication date Jul 27, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Semiconductor Planarization
- Publication number 20170162432
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Structure for Gate Level Inter-Layer Dielectric
- Publication number 20150187594
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS

William Weilun Hong

Person

Patents Grantslast 30 patents

CMP system and method of use

Hard mask removal method

Post-CMP cleaning composition for germanium-containing substrate

Hotspot avoidance method of manufacturing integrated circuits

Metal heterojunction structure with capping metal layer

Hotspot avoidance method for manufacturing integrated circuits

Chemical mechanical planarization using nano-abrasive slurry

Vias with metal caps for underlying conductive lines

CMP slurry and CMP method

CMP system and method of use

Metal heterojunction structure with capping metal layer

Hard mask removal method

CMP slurry and CMP method

Planarization control in semiconductor manufacturing process

Methods for reducing scratch defects in chemical mechanical planari...

Hard mask removal method

Doped poly-silicon for PolyCMP planarity improvement

Hard mask removal method

Surface treatment in a chemical mechanical process

Asymmetric application of pressure to a wafer during a CMP process

Doped poly-silicon for polyCMP planarity improvement

Method and apparatus for semiconductor planarization

Mechanisms for forming oxide layer over exposed polysilicon during...

Composite structure for gate level inter-layer dielectric

CMP slurry particle breakup

Chemical mechanical polishing process with reduced defects in a cop...

Patents Applicationslast 30 patents

METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...

HOTSPOT AVOIDANCE METHOD OF MANUFACTURING INTEGRATED CIRCUITS

CMP System and Method of Use

Hard Mask Removal Method

METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...

Hotspot Avoidance Method of Manufacturing Integrated Circuits

METAL HETEROJUNCTION STRUCTURE WITH CAPPING METAL LAYER

Hotspot Avoidance Method of Manufacturing Integrated Circuits

Hotspot Avoidance Method for Manufacturing Integrated Circuits

POST-CMP CLEANING COMPOSITION FOR GERMANIUM- CONTAINING SUBSTRATE

CMP System and Method of Use

METAL HETEROJUNCTION STRUCTURE WITH CAPPING METAL LAYER

Hard Mask Removal Method

CMP System and Method of Use

CHEMICAL MECHANICAL PLANARIZATION USING NANO-ABRASIVE SLURRY

CMP SLURRY AND CMP METHOD

Methods for Reducing Scratch Defects in Chemical Mechanical Planari...

Hard Mask Removal Method

VIAS WITH METAL CAPS FOR UNDERLYING CONDUCTIVE LINES

METAL HETEROJUNCTION STRUCTURE WITH CAPPING METAL LAYER

CMP SLURRY AND CMP METHOD

Hard Mask Removal Method

DOPED POLY-SILICON FOR POLYCMP PLANARITY IMPROVEMENT

Surface Treatment in a Chemical Mechanical Process

Doped Poly-Silicon for PolyCMP Planarity Improvement

Planarization Control in Semiconductor Manufacturing Process

Asymmetric Application of Pressure to a Wafer During a CMP Process

Methods for Reducing Scratch Defects in Chemical Mechanical Planari...

Method and Apparatus for Semiconductor Planarization

Composite Structure for Gate Level Inter-Layer Dielectric