Wilma Jean Horkans

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electroplated copper interconnection structure, process for making...
- Patent number 7,227,265
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electroplating on resistive substrates
- Patent number 6,974,531
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electroplated interconnection structures on integrated circuit chips
- Patent number 6,946,716
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electroplated interconnection structures on integr...
- Patent number 6,709,562
- Issue date Mar 23, 2004
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling additives in copper plating baths
- Patent number 6,592,747
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Wilma Jean Horkans
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming interconnects on semiconductor substrates and st...
- Patent number 6,570,255
- Issue date May 27, 2003
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnects on semiconductor substrates and st...
- Patent number 6,429,523
- Issue date Aug 6, 2002
- International Business Machines Corp.
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to monitor and add plating solution to plating baths and...
- Patent number 6,406,608
- Issue date Jun 18, 2002
- International Business Machines Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Elimination of photo-induced electrochemical dissolution in chemica...
- Patent number 6,251,787
- Issue date Jun 26, 2001
- International Business Machines Corporation
- Daniel C. Edelstein
- B24 - GRINDING POLISHING
Information Patent Grant
Flip-Chip interconnections using lead-free solders
- Patent number 6,224,690
- Issue date May 1, 2001
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elimination of photo-induced electrochemical dissolution in chemica...
- Patent number 6,153,043
- Issue date Nov 28, 2000
- International Business Machines Corporation
- Daniel C. Edelstein
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus to monitor and add plating solution of plating baths and...
- Patent number 6,113,769
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Barrier layers for electroplated SnPb eutectic solder joints
- Patent number 5,937,320
- Issue date Aug 10, 1999
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High magnetic moment materials and process for fabrication of thin...
- Patent number 5,582,927
- Issue date Dec 10, 1996
- International Business Machines Corporation
- Panayotis C. Andricacos
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Acid electrolyte solution and process for the electrodeposition of...
- Patent number 5,385,661
- Issue date Jan 31, 1995
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for analyzing the addition agents in solutions for electropl...
- Patent number 5,196,096
- Issue date Mar 23, 1993
- International Business Machines Corporation
- I-Chia H. Chang
- G01 - MEASURING TESTING
Information Patent Grant
Cyclic voltammetric method for the measurement of concentrations of...
- Patent number 5,192,403
- Issue date Mar 9, 1993
- International Business Machines Corporation
- I-Chia H. Chang
- G01 - MEASURING TESTING
Information Patent Grant
Prevention of mechanical and electronic failures in heat-treated st...
- Patent number 4,717,591
- Issue date Jan 5, 1988
- International Business Machines Corporation
- Raul E. Acosta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Electroplated interconnection structures on integrated circuit chips
- Publication number 20060017169
- Publication date Jan 26, 2006
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20050199502
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated interconnection structures on integrated circuit chips
- Publication number 20040229456
- Publication date Nov 18, 2004
- International Business Machines
- Panayotis Constantinou Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178078
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178077
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20040069648
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of controlling additives in copper plating baths
- Publication number 20030000850
- Publication date Jan 2, 2003
- Wilma Jean Horkans
- G01 - MEASURING TESTING
Information Patent Application
Method for forming interconnects on semiconductor substrates and st...
- Publication number 20020171151
- Publication date Nov 21, 2002
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERCONNECTS ON SEMICONDUCTOR SUBSTRATES AND ST...
- Publication number 20020105082
- Publication date Aug 8, 2002
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS

Wilma Jean Horkans

Person

Patents Grantslast 30 patents

Electroplated copper interconnection structure, process for making...

Method for electroplating on resistive substrates

Electroplated interconnection structures on integrated circuit chips

Method of making electroplated interconnection structures on integr...

Method of controlling additives in copper plating baths

Method for forming interconnects on semiconductor substrates and st...

Method for forming interconnects on semiconductor substrates and st...

Apparatus to monitor and add plating solution to plating baths and...

Elimination of photo-induced electrochemical dissolution in chemica...

Flip-Chip interconnections using lead-free solders

Elimination of photo-induced electrochemical dissolution in chemica...

Apparatus to monitor and add plating solution of plating baths and...

Barrier layers for electroplated SnPb eutectic solder joints

High magnetic moment materials and process for fabrication of thin...

Acid electrolyte solution and process for the electrodeposition of...

Method for analyzing the addition agents in solutions for electropl...

Cyclic voltammetric method for the measurement of concentrations of...

Prevention of mechanical and electronic failures in heat-treated st...

Patents Applicationslast 30 patents

Electroplated interconnection structures on integrated circuit chips

Method for electroplating on resistive substrates

Electroplated interconnection structures on integrated circuit chips

Electroplated copper interconnection structure, process for making...

Electroplated copper interconnection structure, process for making...

Method for electroplating on resistive substrates

Method of controlling additives in copper plating baths

Method for forming interconnects on semiconductor substrates and st...

METHOD FOR FORMING INTERCONNECTS ON SEMICONDUCTOR SUBSTRATES AND ST...