Wilmer R. Bottoms

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Palo Alto, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
High density interconnect system for IC packages and interconnect a...
- Patent number 7,812,626
- Issue date Oct 12, 2010
- Verigy (Singapore) Pte. Ltd.
- Wilmer R. Bottoms
- G01 - MEASURING TESTING
Information Patent Grant
High density interconnect system for IC packages and interconnect a...
- Patent number 7,579,848
- Issue date Aug 25, 2009
- NanoNexus, Inc.
- Wilmer R. Bottoms
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Flexible DUT interface assembly
- Publication number 20040066207
- Publication date Apr 8, 2004
- Wilmer R. Bottoms
- G01 - MEASURING TESTING