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Wilson Choi
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San Jose, CA, US
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last 30 patents
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Patent Grant
Optimized bond out method for flip chip wafers
Patent number
7,065,721
Issue date
Jun 20, 2006
LSI Logic Corporation
Senol Pekin
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
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Patent Application
Test pin reduction using package center ball grid array
Publication number
20090160475
Publication date
Jun 25, 2009
Anwar Ali
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
Optimized bond out method for flip chip wafers
Publication number
20050028123
Publication date
Feb 3, 2005
Senol Pekin
G06 - COMPUTING CALCULATING COUNTING