Wilson Leung

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San Francisco, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Flipchip bump patterns for efficient I-mesh power distribution schemes
- Patent number 8,350,375
- Issue date Jan 8, 2013
- LSI Logic Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate probe and bond regions of an integrated circuit
- Patent number 8,115,321
- Issue date Feb 14, 2012
- LSI Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEPARATE PROBE AND BOND REGIONS OF AN INTEGRATED CIRCUIT
- Publication number 20100276816
- Publication date Nov 4, 2010
- ANWAR ALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPCHIP BUMP PATTERNS FOR EFFICIENT I-MESH POWER DISTRIBUTION SCHEMES
- Publication number 20090283904
- Publication date Nov 19, 2009
- LSI Logic Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS