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Wing Cheung Ho

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  • Kwai Chung, HK
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wire-bonding apparatus with improved XY-table orientation
    • Patent number 6,808,102
    • Issue date Oct 26, 2004
    • ASM Assembly Automation Ltd.
    • Wing Cheung Ho
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wedge bonding head
    • Patent number 6,513,696
    • Issue date Feb 4, 2003
    • ASM Assembly Automation Ltd.
    • Wing Cheung Ho
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR