Wing Fai Lam

Person

Kwai Chung, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Transfer apparatus for multiple adhesives
- Patent number 8,397,785
- Issue date Mar 19, 2013
- ASM Assembly Automation LTD
- Keung Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for transporting substrates for bonding
- Patent number 8,336,757
- Issue date Dec 25, 2012
- ASM Assembly Automation LTD
- Man Chung Ng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for delivering large amounts of data with interactivity in a...
- Patent number 7,590,751
- Issue date Sep 15, 2009
- Dinastech IPR Limited
- Kwok-Wal Cheung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and system for delivering large amounts of data with interac...
- Patent number 7,200,669
- Issue date Apr 3, 2007
- Dinastech IPR Limited
- Kwok-Wai Cheung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for delivering large amounts of data with interactivity in a...
- Patent number 7,174,384
- Issue date Feb 6, 2007
- Dinastech IPR Limited
- Kwok-Wai Cheung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dispensation of controlled quantities of material onto a substrate
- Patent number 6,991,825
- Issue date Jan 31, 2006
- ASM Assembly Automation Ltd.
- Hon Chiu Hui
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS HAVING A PLURALITY OF ROTARY TRANSFER ARMS FOR TR...
- Publication number 20140341691
- Publication date Nov 20, 2014
- Kui Kam LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSPORTING SUBSTRATES FOR BONDING
- Publication number 20120168489
- Publication date Jul 5, 2012
- Man Chung NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER APPARATUS FOR MULTIPLE ADHESIVES
- Publication number 20110114258
- Publication date May 19, 2011
- Keung CHAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for delivering data over a network
- Publication number 20070174480
- Publication date Jul 26, 2007
- DINASTECH IPR LIMITED
- Kwok-Wai Cheung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
High precision die bonding apparatus
- Publication number 20070134904
- Publication date Jun 14, 2007
- ASM Assembly Automation Ltd
- Ming Yeun Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dispensation of controlled quantities of material onto a substrate
- Publication number 20030209560
- Publication date Nov 13, 2003
- ASM Assembly Automation Ltd
- Hon Chiu Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for delivering data over a network
- Publication number 20030093543
- Publication date May 15, 2003
- Kwok-Wai Cheung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for delivering data over a network
- Publication number 20030074667
- Publication date Apr 17, 2003
- Kwok-Wai Cheung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Wing Fai Lam

Person

Patents Grantslast 30 patents

Transfer apparatus for multiple adhesives

Apparatus for transporting substrates for bonding

Method for delivering large amounts of data with interactivity in a...

Method and system for delivering large amounts of data with interac...

Method for delivering large amounts of data with interactivity in a...

Dispensation of controlled quantities of material onto a substrate

Patents Applicationslast 30 patents

BONDING APPARATUS HAVING A PLURALITY OF ROTARY TRANSFER ARMS FOR TR...

APPARATUS FOR TRANSPORTING SUBSTRATES FOR BONDING

TRANSFER APPARATUS FOR MULTIPLE ADHESIVES

Method and system for delivering data over a network

High precision die bonding apparatus

Dispensation of controlled quantities of material onto a substrate

Method and system for delivering data over a network

Method for delivering data over a network