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Dongguan, CN
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Patents Grants
last 30 patents
Information
Patent Grant
System and method of cleaning and inspecting semiconductor die carrier
Patent number
11,945,004
Issue date
Apr 2, 2024
UTAC HEADQUARTERS PTE. LTD.
Hua Hong Tan
B08 - CLEANING
Information
Patent Grant
Stacked dies electrically connected to a package substrate by lead...
Patent number
11,227,818
Issue date
Jan 18, 2022
UTAC HEADQUARTERS PTE. LTD.
Wing Keung Lam
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
Publication number
20240234195
Publication date
Jul 11, 2024
UTAC Headquarters Pte. Ltd.
Hua Hong Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
Publication number
20240136217
Publication date
Apr 25, 2024
UTAC Headquarters Pte. Ltd.
Hua Hong Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Method of Cleaning and Inspecting Semiconductor Die Carrier
Publication number
20230058682
Publication date
Feb 23, 2023
UTAC Headquarters Pte. Ltd.
Hua Hong Tan
B08 - CLEANING
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
Publication number
20210035891
Publication date
Feb 4, 2021
UTAC Headquarters Pte. Ltd.
Wing Keung LAM
H01 - BASIC ELECTRIC ELEMENTS