Wing Yin LEE

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bonder and a method of cleaning a bond collet
- Patent number 9,318,362
- Issue date Apr 19, 2016
- ASM Technology Singapore Pte. Ltd.
- Mei Po Leung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDER AND A METHOD OF CLEANING A BOND COLLET
- Publication number 20150187617
- Publication date Jul 2, 2015
- Mei Po LEUNG
- H01 - BASIC ELECTRIC ELEMENTS