Membership
Tour
Register
Log in
Wiwat Tanwongwan
Follow
Person
Chatuchak, TH
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for glob top encapsulation using molding tape with elevated...
Patent number
11,637,024
Issue date
Apr 25, 2023
NXP B.V.
Wiwat Tanwongwan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electronic device, device package, and method of fabrication
Patent number
11,114,239
Issue date
Sep 7, 2021
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glob top encapsulation using molding tape
Patent number
10,847,385
Issue date
Nov 24, 2020
NXP B.V.
Wiwat Tanwongwan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Conductive trace design for smart card
Patent number
10,763,203
Issue date
Sep 1, 2020
NXP B.V.
Amornthep Saiyajitara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead finger locking structure
Patent number
9,824,980
Issue date
Nov 21, 2017
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE, DEVICE PACKAGE, AND METHOD OF FABRICATION
Publication number
20210151251
Publication date
May 20, 2021
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLOB TOP ENCAPSULATION USING MOLDING TAPE
Publication number
20210035820
Publication date
Feb 4, 2021
NXP B.V.
Wiwat Tanwongwan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
CONDUCTIVE TRACE DESIGN FOR SMART CARD
Publication number
20200258831
Publication date
Aug 13, 2020
NXP B.V.
Amornthep Saiyajitara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLOB TOP ENCAPSULATION USING MOLDING TAPE
Publication number
20200111685
Publication date
Apr 9, 2020
NXP B.V.
Wiwat Tanwongwan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LEAD FRAME WITH PLATED LEAD TIPS
Publication number
20190229044
Publication date
Jul 25, 2019
NXP B.V.
AMORNTHEP SAIYAJITARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR LEAD FRAME WITH MACHINE READABLE MARK
Publication number
20180226353
Publication date
Aug 9, 2018
NXP B.V.
Ekapong Tangpattanasaeree
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bond Wire Connection
Publication number
20170133342
Publication date
May 11, 2017
NXP B.V.
Wiwat Tanwongwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCING LEAD STRESS IN MICRO-ELECTRONIC PACKAGES
Publication number
20170047275
Publication date
Feb 16, 2017
NXP B.V.
Wiwat Tanwongwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND PACKAGE
Publication number
20170033034
Publication date
Feb 2, 2017
NXP B.V.
Chayathorn Saklang
G01 - MEASURING TESTING
Information
Patent Application
LEAD FINGER LOCKING STRUCTURE
Publication number
20150380362
Publication date
Dec 31, 2015
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS