Wolfgang Gmach

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Emmerting, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating a plurality of slices from workpieces by mean...
- Patent number 12,251,767
- Issue date Mar 18, 2025
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing wafers from a workpiece
- Patent number 9,073,135
- Issue date Jul 7, 2015
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing wafers from a workpiece
- Patent number 8,746,227
- Issue date Jun 10, 2014
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230286067
- Publication date Sep 14, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230234149
- Publication date Jul 27, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS BY MEANS OF A WIRE SAW
- Publication number 20220040883
- Publication date Feb 10, 2022
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WAFERS FROM A WORKPIECE
- Publication number 20120240915
- Publication date Sep 27, 2012
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SLICING WAFERS FROM A WORKPIECE
- Publication number 20120240914
- Publication date Sep 27, 2012
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR