Wolfgang Hauser

Person

Endingen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component with a leadframe
- Patent number 9,620,391
- Issue date Apr 11, 2017
- Micronas GmbH
- Wolfgang Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of SMD components in an IC housing
- Patent number 8,203,168
- Issue date Jun 19, 2012
- Micronas GmbH
- Felix Schinner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit with offset pins
- Patent number 7,414,308
- Issue date Aug 19, 2008
- Micronas GmbH
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for testing a chip with a package and for mounting the packa...
- Patent number 7,284,321
- Issue date Oct 23, 2007
- Micronas GmbH
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit with offset pins
- Patent number 7,053,480
- Issue date May 30, 2006
- Micronas GmbH
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT WITH A LEADFRAME
- Publication number 20160035594
- Publication date Feb 4, 2016
- Micronas GmbH
- Wolfgang HAUSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SMD COMPONENTS IN AN IC HOUSING
- Publication number 20110068460
- Publication date Mar 24, 2011
- Felix SCHINNER
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Support device for monolithically integrated circuits
- Publication number 20060151772
- Publication date Jul 13, 2006
- Giovanni Tricomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for testing a chip with a package and for mounting the packa...
- Publication number 20060108679
- Publication date May 25, 2006
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for testing a chip with a package and for mounting the packa...
- Publication number 20050258849
- Publication date Nov 24, 2005
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for testing a chip with a housing and for placing said housi...
- Publication number 20050009216
- Publication date Jan 13, 2005
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
An electronic component with a leadframe
- Publication number 20040113240
- Publication date Jun 17, 2004
- Wolfgang Hauser
- H01 - BASIC ELECTRIC ELEMENTS

Wolfgang Hauser

Person

Patents Grantslast 30 patents

Electronic component with a leadframe

Integration of SMD components in an IC housing

Integrated circuit with offset pins

Method for testing a chip with a package and for mounting the packa...

Integrated circuit with offset pins

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT WITH A LEADFRAME

INTEGRATION OF SMD COMPONENTS IN AN IC HOUSING

Support device for monolithically integrated circuits

Method for testing a chip with a package and for mounting the packa...

Method for testing a chip with a package and for mounting the packa...

Method for testing a chip with a housing and for placing said housi...

An electronic component with a leadframe