Wolfgang Johannes HETZEL

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Nattheim, DE

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Patents Applicationslast 30 patents

Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
- Publication number 20090008796
- Publication date Jan 8, 2009
- United Test & Assembly Center Ltd.
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS