Wolfgang Lehnert

Person

Lintach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,040,288
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
- Patent number 11,887,894
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 11,735,534
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a template wafer
- Patent number 11,557,505
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor substrate
- Patent number 11,557,506
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Werner Schustereder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a silicon carbide device and wafer composit...
- Patent number 11,373,863
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Roland Rupp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a layer structure, layer structure, method of for...
- Patent number 11,328,935
- Issue date May 10, 2022
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer, methods...
- Patent number 11,107,732
- Issue date Aug 31, 2021
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a silicon carbide wafer, and a silicon carbi...
- Patent number 10,903,078
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer composite and method for producing a semiconductor component
- Patent number 10,784,145
- Issue date Sep 22, 2020
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer composite and method for producing semiconductor components
- Patent number 10,651,072
- Issue date May 12, 2020
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices by bonding a semicond...
- Patent number 10,431,504
- Issue date Oct 1, 2019
- Infineon Technologies Austria AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and processing methods
- Patent number 10,103,123
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device and a semiconductor device
- Patent number 10,020,226
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method of forming a capacitor
- Patent number 9,881,991
- Issue date Jan 30, 2018
- Infineon Technologies AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a wafer structure, a method for forming a semico...
- Patent number 9,793,167
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device and a semiconductor device
- Patent number 9,704,750
- Issue date Jul 11, 2017
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-dimensional material containing electronic components
- Patent number 9,590,044
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Guenther Ruhl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor having a top compressive polycrystalline plate
- Patent number 9,583,559
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite wafer having a graphite core,...
- Patent number 9,576,844
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Rudolf Berger
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for providing a self-aligned pad protection in a semiconduct...
- Patent number 9,385,031
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer for bonding and encapsulating an SiC-based function...
- Patent number 9,349,804
- Issue date May 24, 2016
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite wafer having a graphite core
- Patent number 9,252,045
- Issue date Feb 2, 2016
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 9,236,290
- Issue date Jan 12, 2016
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite wafer having a graphite core,...
- Patent number 9,224,633
- Issue date Dec 29, 2015
- Infineon Technologies AG
- Rudolf Berger
- C30 - CRYSTAL GROWTH
Information Patent Grant
Compound structure and method for forming a compound structure
- Patent number 9,219,049
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method of forming a capacitor
- Patent number 9,196,675
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a power semiconductor device
- Patent number 9,171,728
- Issue date Oct 27, 2015
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a self-aligned pad protection in a semiconduct...
- Patent number 9,165,821
- Issue date Oct 20, 2015
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20240371796
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230395532
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230154978
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Carsten SCHAEFFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method of Producing a Power Semicond...
- Publication number 20220415820
- Publication date Dec 29, 2022
- INFINEON TECHNOLOGIES AG
- Christian Hammer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, DIE, AND DIE PACKAGE
- Publication number 20220230919
- Publication date Jul 21, 2022
- INFINEON TECHNOLOGIES AG
- Fabian CRAES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20210375792
- Publication date Dec 2, 2021
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...
- Publication number 20210351077
- Publication date Nov 11, 2021
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
- Publication number 20210159115
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Werner SCHUSTEREDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A TEMPLATE WAFER
- Publication number 20210013090
- Publication date Jan 14, 2021
- INFINEON TECHNOLOGIES AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Silicon Carbide Device and Wafer Composit...
- Publication number 20200357637
- Publication date Nov 12, 2020
- Roland Rupp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Forming a Layer Structure, Layer Structure, Method of For...
- Publication number 20200227278
- Publication date Jul 16, 2020
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbi...
- Publication number 20190362972
- Publication date Nov 28, 2019
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Wide Band Gap Semiconductor Wafer, Methods...
- Publication number 20190348328
- Publication date Nov 14, 2019
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Composite and Method for Producing a Semiconductor Component
- Publication number 20190244853
- Publication date Aug 8, 2019
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Composite and Method for Producing Semiconductor Components
- Publication number 20190244850
- Publication date Aug 8, 2019
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...
- Publication number 20180366427
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A TEMPLATE WAFER
- Publication number 20180047619
- Publication date Feb 15, 2018
- INFINEON TECHNOLOGIES AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device and a Semiconductor Device
- Publication number 20170309517
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20170236801
- Publication date Aug 17, 2017
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device and a Semiconductor Device
- Publication number 20170033011
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Wafer Structure, a Method for Forming a Semico...
- Publication number 20170033010
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Devices by Bonding a Semicond...
- Publication number 20160260699
- Publication date Sep 8, 2016
- Infineon Technologies Austria AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer Having a SiC-Based Functional Layer
- Publication number 20160225856
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Device
- Publication number 20160086842
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Composite Wafer having a Graphite Core,...
- Publication number 20160086844
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor and Method of Forming a Capacitor
- Publication number 20160043164
- Publication date Feb 11, 2016
- INFINEON TECHNOLOGIES AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING A SELF-ALIGNED PAD PROTECTION IN A SEMICONDUCT...
- Publication number 20150357234
- Publication date Dec 10, 2015
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer Having a Graphite Core
- Publication number 20150279941
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compressive Polycrystalline Silicon Film and Method of Manufacture...
- Publication number 20150194480
- Publication date Jul 9, 2015
- INFINEON TECHNOLOGIES AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20150179507
- Publication date Jun 25, 2015
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS

Wolfgang Lehnert

Person

Patents Grantslast 30 patents

Chip package and method of forming a chip package

Methods for processing a wide band gap semiconductor wafer using a...

Chip package and method of forming a chip package

Method of manufacturing a template wafer

Methods for processing a semiconductor substrate

Method of forming an aluminum oxide layer, metal surface with alumi...

Method of manufacturing a silicon carbide device and wafer composit...

Method of forming a layer structure, layer structure, method of for...

Methods for processing a wide band gap semiconductor wafer, methods...

Methods for processing a silicon carbide wafer, and a silicon carbi...

Wafer composite and method for producing a semiconductor component

Wafer composite and method for producing semiconductor components

Method of manufacturing semiconductor devices by bonding a semicond...

Semiconductor devices and processing methods

Method for forming a semiconductor device and a semiconductor device

Capacitor and method of forming a capacitor

Method for forming a wafer structure, a method for forming a semico...

Method for forming a semiconductor device and a semiconductor device

Two-dimensional material containing electronic components

Capacitor having a top compressive polycrystalline plate

Method for manufacturing a composite wafer having a graphite core,...

Method for providing a self-aligned pad protection in a semiconduct...

Composite wafer for bonding and encapsulating an SiC-based function...

Method for manufacturing a composite wafer having a graphite core

Method for producing a semiconductor device

Method for manufacturing a composite wafer having a graphite core,...

Compound structure and method for forming a compound structure

Capacitor and method of forming a capacitor

Method for forming a power semiconductor device

Method for providing a self-aligned pad protection in a semiconduct...

Patents Applicationslast 30 patents

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR DEVICE

Power Semiconductor Device and Method of Producing a Power Semicond...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, DIE, AND DIE PACKAGE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...

METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

METHOD OF MANUFACTURING A TEMPLATE WAFER

Method of Manufacturing a Silicon Carbide Device and Wafer Composit...

Method of Forming a Layer Structure, Layer Structure, Method of For...

Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbi...

Methods for Processing a Wide Band Gap Semiconductor Wafer, Methods...

Wafer Composite and Method for Producing a Semiconductor Component

Wafer Composite and Method for Producing Semiconductor Components

Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...

METHOD OF MANUFACTURING A TEMPLATE WAFER

Method for Forming a Semiconductor Device and a Semiconductor Device

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

Method for Forming a Semiconductor Device and a Semiconductor Device

Method for Forming a Wafer Structure, a Method for Forming a Semico...

Method of Manufacturing Semiconductor Devices by Bonding a Semicond...

Composite Wafer Having a SiC-Based Functional Layer

Method for Producing a Semiconductor Device

Method for Manufacturing a Composite Wafer having a Graphite Core,...

Capacitor and Method of Forming a Capacitor

METHOD FOR PROVIDING A SELF-ALIGNED PAD PROTECTION IN A SEMICONDUCT...

Composite Wafer Having a Graphite Core

Compressive Polycrystalline Silicon Film and Method of Manufacture...

METHODS FOR PROCESSING A SEMICONDUCTOR DEVICE