Wolfgang Peinhopf

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with top-side insulation layer
- Patent number 9,099,391
- Issue date Aug 4, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device comprising non-integer lead pitches and method of m...
- Patent number 9,035,437
- Issue date May 19, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing thereof
- Patent number 8,618,644
- Issue date Dec 31, 2013
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chip and leads coupled to the semico...
- Patent number 8,253,225
- Issue date Aug 28, 2012
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Top-Side Insulation Layer
- Publication number 20140264944
- Publication date Sep 18, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Device Comprising Non-Integer Lead Pitches and Method of M...
- Publication number 20140264798
- Publication date Sep 18, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND CHIP PACKAGE
- Publication number 20140210061
- Publication date Jul 31, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120319109
- Publication date Dec 20, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20090212284
- Publication date Aug 27, 2009
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS