Wolfgang Winkler

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Tittmoning, DE

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Patents Grantslast 30 patents

Information Patent Grant
Process for material-removing machining of both sides of semiconduc...
- Patent number 6,793,837
- Issue date Sep 21, 2004
- Siltronic AG
- Guido Wenski
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer with improved flatness, and process for produci...
- Patent number 6,583,050
- Issue date Jun 24, 2003
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Guido Wenski
- B24 - GRINDING POLISHING
Information Patent Grant
Process for the double-side polishing of semiconductor wafers and c...
- Patent number 6,514,424
- Issue date Feb 4, 2003
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Guido Wenski
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer with improved flatness, and process for produci...
- Patent number 6,458,688
- Issue date Oct 1, 2002
- Wacker Siltronic Gesellschaft für Halbleiter-Materialien AG
- Guido Wenski
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Process for material-removing machining of both sides of semiconduc...
- Publication number 20030054650
- Publication date Mar 20, 2003
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Guido Wenski
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer with improved flatness, and process for produci...
- Publication number 20030045089
- Publication date Mar 6, 2003
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Guido Wenski
- B24 - GRINDING POLISHING
Information Patent Application
Process for polishing silicon wafers
- Publication number 20020055324
- Publication date May 9, 2002
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Guido Wenski
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for the double-side polishing of semiconductor wafers and c...
- Publication number 20010047978
- Publication date Dec 6, 2001
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Guido Wenski
- B24 - GRINDING POLISHING
Information Patent Application
Process for producing a semiconductor wafer with polished edge
- Publication number 20010014570
- Publication date Aug 16, 2001
- WACKER SILTRONIC GESELLSCHAFT FOR HALBLEITERMATERIALIEN AG
- Guido Wenski
- C30 - CRYSTAL GROWTH