Wolfram Hable

Person

Neumarkt, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module including a semiconductor package connected to a...
- Patent number 11,955,407
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-cooled package having shielding layer
- Patent number 11,862,533
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package cooled with cooling fluid and comprising shielding layer
- Patent number 11,244,886
- Issue date Feb 8, 2022
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier with electrically conductive layer extending beyond th...
- Patent number 10,615,097
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with partially encapsulated cooling channel for cooling an...
- Patent number 10,461,017
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Andreas Grassmann
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,283,432
- Issue date May 7, 2019
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package with vertically spaced partially encapsulated contact struc...
- Patent number 10,128,165
- Issue date Nov 13, 2018
- Infineon Technologies AG
- Wolfram Hable
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor chip package comprising laterally extending connectors
- Patent number 10,079,195
- Issue date Sep 18, 2018
- Infineon Technologies AG
- Wolfram Hable
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,074,590
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,589,922
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, chip arrangement, and method for manufacturing the same
- Patent number 9,585,241
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,397,018
- Issue date Jul 19, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,362,193
- Issue date Jun 7, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with cooling structure on bonding substrate for coolin...
- Patent number 9,275,926
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having at least two substrates
- Patent number 7,592,696
- Issue date Sep 22, 2009
- Infineon Technologies AG
- Wolfram Hable
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module comprising at least two substrates and method for prod...
- Patent number 7,176,057
- Issue date Feb 13, 2007
- Infineon Technologies AG
- Wolfram Hable
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON...
- Publication number 20240194566
- Publication date Jun 13, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid-Cooled Package Having Shielding Layer
- Publication number 20220115293
- Publication date Apr 14, 2022
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A...
- Publication number 20210225734
- Publication date Jul 22, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded package with chip carrier comprising brazed electrically con...
- Publication number 20190006260
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Mark PAVIER
- B60 - VEHICLES IN GENERAL
Information Patent Application
Package with vertically spaced partially encapsulated contact struc...
- Publication number 20180122720
- Publication date May 3, 2018
- INFINEON TECHNOLOGIES AG
- Wolfram HABLE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Chip carrier with electrically conductive layer extending beyond th...
- Publication number 20180102302
- Publication date Apr 12, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package cooled with cooling fluid and comprising shielding layer
- Publication number 20180082925
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with partially encapsulated cooling channel for cooling an...
- Publication number 20180040537
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE COMPRISING LATERALLY EXTENDING CONNECTORS
- Publication number 20170200666
- Publication date Jul 13, 2017
- INFINEON TECHNOLOGIES AG
- Wolfram Hable
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20170154835
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module comprising fluid cooling channel and method of ma...
- Publication number 20160322333
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20150264796
- Publication date Sep 17, 2015
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150085446
- Publication date Mar 26, 2015
- INFINEON TECHNOLOGIES AG
- Wolfram Hable
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power module comprising two substrates and method of manufacturing...
- Publication number 20140353818
- Publication date Dec 4, 2014
- Ottmar GEITNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module with cooling structure on bonding substrate for coolin...
- Publication number 20140327127
- Publication date Nov 6, 2014
- Wolfram HABLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...
- Publication number 20140197552
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20120075812
- Publication date Mar 29, 2012
- INFINEON TECHNOLOGIES AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module having at least two substrates
- Publication number 20070099437
- Publication date May 3, 2007
- Infineon Technologies AG
- Wolfram Hable
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power module comprising at least two substrates and method for prod...
- Publication number 20050237722
- Publication date Oct 27, 2005
- Wolfram Hable
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power module and process for producing power modules
- Publication number 20030112605
- Publication date Jun 19, 2003
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS

Wolfram Hable

Person

Patents Grantslast 30 patents

Electronic module including a semiconductor package connected to a...

Fluid-cooled package having shielding layer

Power module comprising two substrates and method of manufacturing...

Package cooled with cooling fluid and comprising shielding layer

Chip carrier with electrically conductive layer extending beyond th...

Package with partially encapsulated cooling channel for cooling an...

Molded package with chip carrier comprising brazed electrically con...

Package with vertically spaced partially encapsulated contact struc...

Semiconductor chip package comprising laterally extending connectors

Molded package with chip carrier comprising brazed electrically con...

Electronic module comprising fluid cooling channel and method of ma...

Electronic module and method of manufacturing the same

Substrate, chip arrangement, and method for manufacturing the same

Chip arrangement, a method for manufacturing a chip arrangement, in...

Chip arrangement, a method for manufacturing a chip arrangement, in...

Power module with cooling structure on bonding substrate for coolin...

Power module having at least two substrates

Power module comprising at least two substrates and method for prod...

Patents Applicationslast 30 patents

AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON...

Fluid-Cooled Package Having Shielding Layer

ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A...

Molded package with chip carrier comprising brazed electrically con...

Package with vertically spaced partially encapsulated contact struc...

Chip carrier with electrically conductive layer extending beyond th...

Package cooled with cooling fluid and comprising shielding layer

Package with partially encapsulated cooling channel for cooling an...

SEMICONDUCTOR CHIP PACKAGE COMPRISING LATERALLY EXTENDING CONNECTORS

Electronic module and method of manufacturing the same

Electronic module comprising fluid cooling channel and method of ma...

Electronic module and method of manufacturing the same

SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME

Power module comprising two substrates and method of manufacturing...

Power module with cooling structure on bonding substrate for coolin...

CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...

MULTI-CHIP PACKAGE

Power module having at least two substrates

Power module comprising at least two substrates and method for prod...

Power module and process for producing power modules