Won-Cheol Bae

Person

Kyunggi-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a component-embedded printed circuit board
- Patent number 8,011,086
- Issue date Sep 6, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo-Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a component-embedded PCB
- Patent number 7,886,433
- Issue date Feb 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Won-Cheol Bae
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate embedded with passive device
- Patent number 7,704,846
- Issue date Apr 27, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung-Hyun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with weak magnetic field sensor
- Patent number 7,394,249
- Issue date Jul 1, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board having weak magnetic field sensor and method...
- Patent number 7,348,772
- Issue date Mar 25, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- G01 - MEASURING TESTING
Information Patent Grant
Actuator employing a bobbin incorporating a winding coil and a manu...
- Patent number 7,337,453
- Issue date Feb 26, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE EMBEDDED WITH PASSIVE DEVICE
- Publication number 20100163291
- Publication date Jul 1, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung-Hyun CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a package board
- Publication number 20090124043
- Publication date May 14, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Won-Cheol Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board having embedded components and method for man...
- Publication number 20080196931
- Publication date Aug 21, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Sang-Chul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component-embedded PCB and manufacturing method thereof
- Publication number 20080171172
- Publication date Jul 17, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Won-Cheol Bae
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of manufacturing a component-embedded printed circuit board
- Publication number 20080052906
- Publication date Mar 6, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Doo-Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component-embedded multilayer printed wiring board and manufacturin...
- Publication number 20080041619
- Publication date Feb 21, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Doo-Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate embedded with passive device
- Publication number 20070087512
- Publication date Apr 19, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Seung-Hyun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board having weak magnetic field sensor and method...
- Publication number 20060017435
- Publication date Jan 26, 2006
- Samsung Electro-Mechanics CO., LTD.
- Myung-Sam Kang
- G01 - MEASURING TESTING
Information Patent Application
Printed circuit board with weak magnetic field sensor and method of...
- Publication number 20060001422
- Publication date Jan 5, 2006
- Samsung Electro-Mechanics CO., LTD.
- Myung-Sam kang
- G01 - MEASURING TESTING
Information Patent Application
Actuator employing a bobbin incorporating a winding coil and a manu...
- Publication number 20050060732
- Publication date Mar 17, 2005
- Myung-Sam Kang
- G11 - INFORMATION STORAGE

Won-Cheol Bae

Person

Patents Grantslast 30 patents

Method of manufacturing a component-embedded printed circuit board

Method of manufacturing a component-embedded PCB

Substrate embedded with passive device

Printed circuit board with weak magnetic field sensor

Printed circuit board having weak magnetic field sensor and method...

Actuator employing a bobbin incorporating a winding coil and a manu...

Patents Applicationslast 30 patents

SUBSTRATE EMBEDDED WITH PASSIVE DEVICE

Method of manufacturing a package board

Printed circuit board having embedded components and method for man...

Component-embedded PCB and manufacturing method thereof

Method of manufacturing a component-embedded printed circuit board

Component-embedded multilayer printed wiring board and manufacturin...

Substrate embedded with passive device

Printed circuit board having weak magnetic field sensor and method...

Printed circuit board with weak magnetic field sensor and method of...

Actuator employing a bobbin incorporating a winding coil and a manu...