Won Kyoung Choi

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming double-sided fan-out waf...
- Patent number 11,127,668
- Issue date Sep 21, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 10,662,056
- Issue date May 26, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of packaging thin die and semiconductor device including thi...
- Patent number 10,510,632
- Issue date Dec 17, 2019
- STATS ChipPAC Pte. Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming double-sided fan-out waf...
- Patent number 10,453,785
- Issue date Oct 22, 2019
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 10,446,479
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
- Patent number 10,388,612
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 10,189,702
- Issue date Jan 29, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming low profile fan-out pack...
- Patent number 9,978,665
- Issue date May 22, 2018
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of singulating thin semiconductor w...
- Patent number 9,934,998
- Issue date Apr 3, 2018
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 9,842,798
- Issue date Dec 12, 2017
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer in notc...
- Patent number 9,837,336
- Issue date Dec 5, 2017
- STATS ChipPAC, Pte. Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
- Patent number 9,754,897
- Issue date Sep 5, 2017
- STATS ChipPAC, Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming fine pitch RDL over semi...
- Patent number 9,721,922
- Issue date Aug 1, 2017
- STATS ChipPAC, Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming low profile fan-out pack...
- Patent number 9,704,780
- Issue date Jul 11, 2017
- STATS ChipPAC, Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming UBM structure on back su...
- Patent number 9,601,462
- Issue date Mar 21, 2017
- STATS ChipPAC Pte. Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of singulating thin semiconductor w...
- Patent number 9,559,004
- Issue date Jan 31, 2017
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 9,527,723
- Issue date Dec 27, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit system with debonding adhesive and method of man...
- Patent number 9,355,993
- Issue date May 31, 2016
- Stats Chippac Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of reducing warpage using a silicon...
- Patent number 9,184,139
- Issue date Nov 10, 2015
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure o...
- Patent number 9,105,532
- Issue date Aug 11, 2015
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with debonding adhesive and method of man...
- Patent number 9,076,724
- Issue date Jul 7, 2015
- Stats Chippac Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective coating over...
- Patent number 8,912,650
- Issue date Dec 16, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure o...
- Patent number 8,890,315
- Issue date Nov 18, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming UBM structure on back su...
- Patent number 8,809,191
- Issue date Aug 19, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer in notc...
- Patent number 8,742,591
- Issue date Jun 3, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and a method of forming a wafer level package
- Patent number 8,729,695
- Issue date May 20, 2014
- Agency for Science, Technology and Research
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming interconnect structure o...
- Patent number 8,587,120
- Issue date Nov 19, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective coating over...
- Patent number 8,435,881
- Issue date May 7, 2013
- STAT ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20220289560
- Publication date Sep 15, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20200399117
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Double-Sided Fan-Out Waf...
- Publication number 20200006215
- Publication date Jan 2, 2020
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Packaging Thin Die and Semiconductor Device Including Thi...
- Publication number 20190287873
- Publication date Sep 19, 2019
- STATS ChipPAC Pte Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20190047845
- Publication date Feb 14, 2019
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...
- Publication number 20170330840
- Publication date Nov 16, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20170297903
- Publication date Oct 19, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Low Profile Fan-Out Pack...
- Publication number 20170271241
- Publication date Sep 21, 2017
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Singulating Thin Semiconductor W...
- Publication number 20170092529
- Publication date Mar 30, 2017
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Double-Sided Fan-Out Waf...
- Publication number 20160043047
- Publication date Feb 11, 2016
- STATS ChipPAC, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...
- Publication number 20150348936
- Publication date Dec 3, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH DEBONDING ADHESIVE AND METHOD OF MAN...
- Publication number 20150311180
- Publication date Oct 29, 2015
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20150259194
- Publication date Sep 17, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Fine Pitch RDL Over Semi...
- Publication number 20150179570
- Publication date Jun 25, 2015
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Reducing Warpage Using a Silicon...
- Publication number 20150171024
- Publication date Jun 18, 2015
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure O...
- Publication number 20150054151
- Publication date Feb 26, 2015
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming UBM Structure on Back Su...
- Publication number 20140264851
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer in Notc...
- Publication number 20140225279
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Low Profile Fan-Out Pack...
- Publication number 20140159251
- Publication date Jun 12, 2014
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20140103527
- Publication date Apr 17, 2014
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure O...
- Publication number 20140008791
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Over...
- Publication number 20130228919
- Publication date Sep 5, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer in Notc...
- Publication number 20130161824
- Publication date Jun 27, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming UBM Structure on Back Su...
- Publication number 20130147036
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Bonded Structure
- Publication number 20130037603
- Publication date Feb 14, 2013
- AGENCY FOR SCIENCE ,TECHNOLOGY AND RESEARCH
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and a Method of Forming a Wafer Level Package
- Publication number 20130020713
- Publication date Jan 24, 2013
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure O...
- Publication number 20120326296
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Over...
- Publication number 20120326297
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Singulating Thin Semiconductor W...
- Publication number 20120286429
- Publication date Nov 15, 2012
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS

Won Kyoung Choi

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming microelectromechanical s...

Semiconductor device and method of forming double-sided fan-out waf...

Semiconductor device and method of forming microelectromechanical s...

Method of packaging thin die and semiconductor device including thi...

Semiconductor device and method of forming double-sided fan-out waf...

Semiconductor device and method of forming a PoP device with embedd...

Semiconductor device and method of forming electromagnetic (EM) shi...

Semiconductor device and method of forming microelectromechanical s...

Semiconductor device and method of forming low profile fan-out pack...

Semiconductor device and method of singulating thin semiconductor w...

Semiconductor device and method of forming a PoP device with embedd...

Semiconductor device and method of forming insulating layer in notc...

Semiconductor device and method of forming electromagnetic (EM) shi...

Semiconductor device and method of forming fine pitch RDL over semi...

Semiconductor device and method of forming low profile fan-out pack...

Semiconductor device and method of forming UBM structure on back su...

Semiconductor device and method of singulating thin semiconductor w...

Semiconductor device and method of forming microelectromechanical s...

Integrated circuit system with debonding adhesive and method of man...

Semiconductor device and method of reducing warpage using a silicon...

Semiconductor device and method of forming interconnect structure o...

Integrated circuit system with debonding adhesive and method of man...

Semiconductor device and method of forming protective coating over...

Semiconductor device and method of forming interconnect structure o...

Semiconductor device and method of forming UBM structure on back su...

Semiconductor device and method of forming insulating layer in notc...

Wafer level package and a method of forming a wafer level package

Semiconductor device and method of forming interconnect structure o...

Semiconductor device and method of forming protective coating over...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Microelectromechanical S...

Semiconductor Device and Method of Forming Microelectromechanical S...

Semiconductor Device and Method of Forming Double-Sided Fan-Out Waf...

Method of Packaging Thin Die and Semiconductor Device Including Thi...

Semiconductor Device and Method of Forming Microelectromechanical S...

Semiconductor Device and Method of Forming a POP Device with Embedd...

Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...

Semiconductor Device and Method of Forming Microelectromechanical S...

Semiconductor Device and Method of Forming Low Profile Fan-Out Pack...

Semiconductor Device and Method of Singulating Thin Semiconductor W...

Semiconductor Device and Method of Forming Double-Sided Fan-Out Waf...

Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...

INTEGRATED CIRCUIT SYSTEM WITH DEBONDING ADHESIVE AND METHOD OF MAN...

Semiconductor Device and Method of Forming Microelectromechanical S...

Semiconductor Device and Method of Forming Fine Pitch RDL Over Semi...

Semiconductor Device and Method of Reducing Warpage Using a Silicon...

Semiconductor Device and Method of Forming Interconnect Structure O...

Semiconductor Device and Method of Forming UBM Structure on Back Su...

Semiconductor Device and Method of Forming Insulating Layer in Notc...

Semiconductor Device and Method of Forming Low Profile Fan-Out Pack...

Semiconductor Device and Method of Forming a POP Device with Embedd...

Semiconductor Device and Method of Forming Interconnect Structure O...

Semiconductor Device and Method of Forming Protective Coating Over...

Semiconductor Device and Method of Forming Insulating Layer in Notc...

Semiconductor Device and Method of Forming UBM Structure on Back Su...

Method of Forming a Bonded Structure

Wafer Level Package and a Method of Forming a Wafer Level Package

Semiconductor Device and Method of Forming Interconnect Structure O...

Semiconductor Device and Method of Forming Protective Coating Over...

Semiconductor Device and Method of Singulating Thin Semiconductor W...