WONBIN SHIN

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240194553
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Jinyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240194582
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Seokkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240145361
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- WONBIN SHIN
- H01 - BASIC ELECTRIC ELEMENTS