Wonchul Lee

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Directional deposition in etch chamber
- Patent number 11,742,212
- Issue date Aug 29, 2023
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch process with pre-etch transient conditioning
- Patent number 9,607,848
- Issue date Mar 28, 2017
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous plasma etch process
- Patent number 9,530,658
- Issue date Dec 27, 2016
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch process with pre-etch transient conditioning
- Patent number 9,257,296
- Issue date Feb 9, 2016
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch process with pre-etch transient conditioning
- Patent number 9,142,417
- Issue date Sep 22, 2015
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous plasma ETCH process
- Patent number 9,129,902
- Issue date Sep 8, 2015
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch with pulsed bias
- Patent number 9,059,116
- Issue date Jun 16, 2015
- Lam Research Corporation
- Amit Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of hard mask CD control by Ar sputtering
- Patent number 8,802,571
- Issue date Aug 12, 2014
- Lam Research Corporation
- Wonchul Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed bias plasma process to control microloading
- Patent number 8,609,546
- Issue date Dec 17, 2013
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling etch microloading for a tungsten-containing l...
- Patent number 8,518,282
- Issue date Aug 27, 2013
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch of high-k dielectric material
- Patent number 8,124,538
- Issue date Feb 28, 2012
- Lam Research Corporation
- In Deog Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing microloading in etching high aspect ratio struc...
- Patent number 7,629,255
- Issue date Dec 8, 2009
- Lam Research Corporation
- Qian Fu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECTIONAL DEPOSITION IN ETCH CHAMBER
- Publication number 20220028697
- Publication date Jan 27, 2022
- LAM RESEARCH CORPORATION
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROCESS WITH PRE-ETCH TRANSIENT CONDITIONING
- Publication number 20160155645
- Publication date Jun 2, 2016
- LAM RESEARCH CORPORATION
- Wonchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROCESS WITH PRE-ETCH TRANSIENT CONDITIONING
- Publication number 20150380264
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Wonchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS PLASMA ETCH PROCESS
- Publication number 20150348792
- Publication date Dec 3, 2015
- LAM RESEARCH CORPORATION
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS PLASMA ETCH PROCESS
- Publication number 20140329391
- Publication date Nov 6, 2014
- LAM RESEARCH CORPORATION
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROCESS WITH PRE-ETCH TRANSIENT CONDITIONING
- Publication number 20140167228
- Publication date Jun 19, 2014
- LAM RESEARCH CORPORATION
- Wonchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH WITH PULSED BIAS
- Publication number 20130084708
- Publication date Apr 4, 2013
- LAM RESEARCH CORPORATION
- Amit JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HARD MASK CD CONTROL BY AR SPUTTERING
- Publication number 20130029491
- Publication date Jan 31, 2013
- LAM RESEARCH CORPORATION
- Wonchul Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PULSED BIAS PLASMA PROCESS TO CONTROL MICROLOADING
- Publication number 20110281438
- Publication date Nov 17, 2011
- LAM RESEARCH CORPORATION
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING ETCH MICROLOADING FOR A TUNGSTEN-CONTAINING L...
- Publication number 20110151670
- Publication date Jun 23, 2011
- LAM RESEARCH CORPORATION
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCH OF HIGH-K DIELECTRIC MATERIAL
- Publication number 20090258502
- Publication date Oct 15, 2009
- LAM RESEARCH CORPORATION
- In Deog BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING MICROLOADING IN ETCHING HIGH ASPECT RATIO STRUC...
- Publication number 20080296736
- Publication date Dec 4, 2008
- LAM RESEARCH CORPORATION
- Qian Fu
- H01 - BASIC ELECTRIC ELEMENTS

Wonchul Lee

Person

Patents Grantslast 30 patents

Directional deposition in etch chamber

Etch process with pre-etch transient conditioning

Continuous plasma etch process

Etch process with pre-etch transient conditioning

Etch process with pre-etch transient conditioning

Continuous plasma ETCH process

Etch with pulsed bias

Method of hard mask CD control by Ar sputtering

Pulsed bias plasma process to control microloading

Method of controlling etch microloading for a tungsten-containing l...

Selective etch of high-k dielectric material

Method for reducing microloading in etching high aspect ratio struc...

Patents Applicationslast 30 patents

DIRECTIONAL DEPOSITION IN ETCH CHAMBER

ETCH PROCESS WITH PRE-ETCH TRANSIENT CONDITIONING

ETCH PROCESS WITH PRE-ETCH TRANSIENT CONDITIONING

CONTINUOUS PLASMA ETCH PROCESS

CONTINUOUS PLASMA ETCH PROCESS

ETCH PROCESS WITH PRE-ETCH TRANSIENT CONDITIONING

ETCH WITH PULSED BIAS

METHOD OF HARD MASK CD CONTROL BY AR SPUTTERING

PULSED BIAS PLASMA PROCESS TO CONTROL MICROLOADING

METHOD OF CONTROLLING ETCH MICROLOADING FOR A TUNGSTEN-CONTAINING L...

SELECTIVE ETCH OF HIGH-K DIELECTRIC MATERIAL

METHOD FOR REDUCING MICROLOADING IN ETCHING HIGH ASPECT RATIO STRUC...