Wonhyuk Hong

Person

Clifton Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit devices including discharging path and methods o...
- Patent number 12,087,669
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Jaehong Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION...
- Publication number 20240421154
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jongjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE FORMATION METHOD OF CMOS FOR 3D STACKED FET WITH BSPDN
- Publication number 20240413213
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Keumseok PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240363491
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- SEUNGCHAN YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240332185
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- TAE SUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT STRUCTURE
- Publication number 20240290689
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Seungchan YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240290866
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Wonhyuk HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SELF-ALIGNED BACKSIDE CONTACT STRUCT...
- Publication number 20240282670
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Myung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING
- Publication number 20240203793
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Tae Sun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTOR WITH UNIFORM SOURCE/DRAIN REGIONS ON SELF-A...
- Publication number 20240105615
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jongjin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240096984
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jongjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240079329
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- EUN SUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240079330
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240063122
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- SEUNGCHAN YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...
- Publication number 20230369111
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET RECESS FOR RU SUBTRACTIVE PROCESS
- Publication number 20230361032
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Wonhyuk HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL LINES SPACED APART FROM...
- Publication number 20230352405
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Janggeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING BACKSIDE POWER RAIL AND METHOD...
- Publication number 20230352408
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- MYUNGHOON JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE CONNECTING FRONT SIDE STRUCTURE OF SEMICONDUCTOR DEVI...
- Publication number 20230343839
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Eun Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSED HIGH ASPECT RATIO CONTACT (HARC) STRUCTURE AND PROCESS
- Publication number 20230326858
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Buhyun HAM
- H01 - BASIC ELECTRIC ELEMENTS

Wonhyuk Hong

Person

Patents Grantslast 30 patents

Integrated circuit devices including discharging path and methods o...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION...

NOBLE FORMATION METHOD OF CMOS FOR 3D STACKED FET WITH BSPDN

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICE INCLUDING SELF-ALIGNED BACKSIDE CONTACT STRUCT...

BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING

FIELD-EFFECT TRANSISTOR WITH UNIFORM SOURCE/DRAIN REGIONS ON SELF-A...

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...

WET RECESS FOR RU SUBTRACTIVE PROCESS

INTEGRATED CIRCUIT DEVICES INCLUDING METAL LINES SPACED APART FROM...

INTEGRATED CIRCUIT DEVICES INCLUDING BACKSIDE POWER RAIL AND METHOD...

VIA STRUCTURE CONNECTING FRONT SIDE STRUCTURE OF SEMICONDUCTOR DEVI...

REVERSED HIGH ASPECT RATIO CONTACT (HARC) STRUCTURE AND PROCESS