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WonIl Kwon
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Seoul, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of controlling warpage in semicondu...
Patent number
9,406,579
Issue date
Aug 2, 2016
STATS ChipPAC Pte. Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of backgrinding and singulation of...
Patent number
9,401,289
Issue date
Jul 26, 2016
STATS ChipPAC Pte. Ltd.
MinJung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging system with multipart conductive pillars an...
Patent number
8,304,296
Issue date
Nov 6, 2012
Stats Chippac Ltd.
ChanHoon Ko
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming Multi-Layered UBM with I...
Publication number
20140070410
Publication date
Mar 13, 2014
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Backgrinding and Singulation of...
Publication number
20130320519
Publication date
Dec 5, 2013
STATS ChipPAC, Ltd.
MinJung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Controlling Warpage in Semicondu...
Publication number
20130300004
Publication date
Nov 14, 2013
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COUPLING FEATURES AND METH...
Publication number
20130154107
Publication date
Jun 20, 2013
MinJung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Multi-Layered UBM with I...
Publication number
20120211900
Publication date
Aug 23, 2012
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING SYSTEM WITH MULTIPART CONDUCTIVE PILLARS AN...
Publication number
20110316155
Publication date
Dec 29, 2011
ChanHoon Ko
H01 - BASIC ELECTRIC ELEMENTS