Wonjin CHO

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Berlin, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for increasing adhesion strength between a metal and an orga...
- Patent number 11,991,835
- Issue date May 21, 2024
- Atotech Deutschland GmbH
- Felix Tang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for increasing adhesion strength between a surface of copper...
- Patent number 11,963,308
- Issue date Apr 16, 2024
- Atotech Deutschland GmbH & Co. KG
- Norbert Lützow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a printed circuit board
- Patent number 10,477,700
- Issue date Nov 12, 2019
- Atotech Deutschland GmbH
- Wonjin Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A METAL AND AN ORGA...
- Publication number 20220151080
- Publication date May 12, 2022
- Atotech Deutschland GmbH
- Felix TANG
- B32 - LAYERED PRODUCTS
Information Patent Application
A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...
- Publication number 20210251085
- Publication date Aug 12, 2021
- Atotech Deutschland GmbH
- Norbert LÜTZOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20190297732
- Publication date Sep 26, 2019
- Atotech Deutschland GmbH
- Wonjin CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR