WonJun Ko

Person

Ichon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming a low profile dual-purpo...
- Patent number 10,163,744
- Issue date Dec 25, 2018
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of calibrating warpage testing syst...
- Patent number 9,279,673
- Issue date Mar 8, 2016
- STATS ChipPAC, Ltd.
- WonJun Ko
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of stacking semiconductor die in mo...
- Patent number 9,252,032
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with wafer scale heat slug
- Patent number 8,618,653
- Issue date Dec 31, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing multi-package module te...
- Patent number 8,609,463
- Issue date Dec 17, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with collapsed multi-integratio...
- Patent number 8,569,882
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with dielectric support and met...
- Patent number 8,546,957
- Issue date Oct 1, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with trenches and method of man...
- Patent number 8,536,718
- Issue date Sep 17, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective coating mater...
- Patent number 8,524,537
- Issue date Sep 3, 2013
- STATS ChipPAC, Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with heat spreader and method o...
- Patent number 8,415,204
- Issue date Apr 9, 2013
- Stats Chippac Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die in mo...
- Patent number 8,263,435
- Issue date Sep 11, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 8,227,925
- Issue date Jul 24, 2012
- Stats Chippac Ltd.
- Sungmin Song
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 8,124,451
- Issue date Feb 28, 2012
- Stats Chippac Ltd.
- Sungmin Song
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package system with package integration
- Patent number 8,067,275
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with support structure under wire...
- Patent number 8,035,211
- Issue date Oct 11, 2011
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base package system for integrated circuit package stacking and met...
- Patent number 8,022,538
- Issue date Sep 20, 2011
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Calibrating Warpage Testing Syst...
- Publication number 20140269810
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- WonJun Ko
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Mater...
- Publication number 20130256840
- Publication date Oct 3, 2013
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Low Profile Dual-Purpo...
- Publication number 20130056862
- Publication date Mar 7, 2013
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die in Mo...
- Publication number 20120299174
- Publication date Nov 29, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATIO...
- Publication number 20120241980
- Publication date Sep 27, 2012
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20120146243
- Publication date Jun 14, 2012
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIELECTRIC SUPPORT AND MET...
- Publication number 20120146246
- Publication date Jun 14, 2012
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die in Mo...
- Publication number 20120104624
- Publication date May 3, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRENCHES AND METHOD OF MAN...
- Publication number 20110316162
- Publication date Dec 29, 2011
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Mater...
- Publication number 20110266656
- Publication date Nov 3, 2011
- STATS ChipPAC, Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...
- Publication number 20100244236
- Publication date Sep 30, 2010
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE PACKAGE SYSTEM FOR INTEGRATED CIRCUIT PACKAGE STACKING AND MET...
- Publication number 20100123247
- Publication date May 20, 2010
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE...
- Publication number 20090243070
- Publication date Oct 1, 2009
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFER SCALE HEAT SLUG
- Publication number 20090189275
- Publication date Jul 30, 2009
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION
- Publication number 20090155961
- Publication date Jun 18, 2009
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20090079091
- Publication date Mar 26, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MULTI-PACKAGE MODULE TE...
- Publication number 20080227238
- Publication date Sep 18, 2008
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming a low profile dual-purpo...

Semiconductor device and method of calibrating warpage testing syst...

Semiconductor device and method of stacking semiconductor die in mo...

Integrated circuit package system with wafer scale heat slug

Integrated circuit package system employing multi-package module te...

Integrated circuit packaging system with collapsed multi-integratio...

Integrated circuit packaging system with dielectric support and met...

Integrated circuit packaging system with trenches and method of man...

Semiconductor device and method of forming protective coating mater...

Integrated circuit packaging system with heat spreader and method o...

Semiconductor device and method of stacking semiconductor die in mo...

Integrated circuit packaging system with interposer

Integrated circuit packaging system with interposer

Integrated circuit package system with package integration

Integrated circuit package system with support structure under wire...

Base package system for integrated circuit package stacking and met...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Calibrating Warpage Testing Syst...

Semiconductor Device and Method of Forming Protective Coating Mater...

Semiconductor Device and Method of Forming a Low Profile Dual-Purpo...

Semiconductor Device and Method of Stacking Semiconductor Die in Mo...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATIO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIELECTRIC SUPPORT AND MET...

Semiconductor Device and Method of Stacking Semiconductor Die in Mo...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRENCHES AND METHOD OF MAN...

Semiconductor Device and Method of Forming Protective Coating Mater...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...

BASE PACKAGE SYSTEM FOR INTEGRATED CIRCUIT PACKAGE STACKING AND MET...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFER SCALE HEAT SLUG

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MULTI-PACKAGE MODULE TE...