Wonkeun KIM

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material paste and semiconductor package
- Patent number 11,876,031
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device, and semiconductor package...
- Patent number 11,784,168
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device, and semiconductor package...
- Patent number 11,342,310
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate and packaging method using the same
- Patent number 11,211,273
- Issue date Dec 28, 2021
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding method
- Patent number 10,910,339
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Hwail Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,177,942
- Issue date Nov 3, 2015
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,673,688
- Issue date Mar 18, 2014
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297150
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE SHEET, METHOD OF MANUFACTURING THE SAME AND METHOD OF...
- Publication number 20240079260
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hansol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USIN...
- Publication number 20230135089
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Hansol YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM...
- Publication number 20230086253
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Seonho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND METHOD OF SEPARATING...
- Publication number 20230040281
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Cheonil PARK
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...
- Publication number 20220278079
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL PASTE AND SEMICONDUCTOR PACKAGE
- Publication number 20220020664
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...
- Publication number 20210384162
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME
- Publication number 20200135498
- Publication date Apr 30, 2020
- Samsung Electronics Co., Ltd.
- Ji-Han KO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
FLIP CHIP BONDING METHOD
- Publication number 20200058615
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150069635
- Publication date Mar 12, 2015
- Samsung Electronics Co., Ltd.
- Wonkeun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method Of Manufacturing The Same
- Publication number 20120100671
- Publication date Apr 26, 2012
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Wonkeun KIM

Person

Patents Grantslast 30 patents

Thermal interface material paste and semiconductor package

Semiconductor chip, semiconductor device, and semiconductor package...

Semiconductor chip, semiconductor device, and semiconductor package...

Carrier substrate and packaging method using the same

Flip chip bonding method

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

ADHESIVE TAPE SHEET, METHOD OF MANUFACTURING THE SAME AND METHOD OF...

RELEASE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USIN...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND METHOD OF SEPARATING...

SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...

THERMAL INTERFACE MATERIAL PASTE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...

CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME

FLIP CHIP BONDING METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Package And Method Of Manufacturing The Same