Wonll Kwon

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming multi-layered UBM with i...
- Patent number 9,252,093
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with coupling features and meth...
- Patent number 8,710,670
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming multi-layered UBM with i...
- Patent number 8,642,469
- Issue date Feb 4, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS