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WOOCHAN KIM
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SUNNYVALE, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
IC package with heat spreader
Patent number
12,009,280
Issue date
Jun 11, 2024
Texas Instruments Incorporated
Rongwei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolated semiconductor package with HV isolator on block
Patent number
11,929,311
Issue date
Mar 12, 2024
Texas Instruments Incorporated
Vivek K Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with isolated heat spreader
Patent number
11,923,281
Issue date
Mar 5, 2024
Texas Instruments Incorporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package with reinforced isolation
Patent number
11,908,834
Issue date
Feb 20, 2024
Texas Instruments Incorporated
Vivek Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package panel processing with integrated ceramic isolation
Patent number
11,869,839
Issue date
Jan 9, 2024
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power conversion module and method of forming the same
Patent number
11,751,353
Issue date
Sep 5, 2023
Texas Instruments Incorporated
Woochan Kim
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Power stage package including flexible circuit and stacked die
Patent number
11,715,679
Issue date
Aug 1, 2023
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power converter module
Patent number
11,601,065
Issue date
Mar 7, 2023
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor devices for high voltage with die edge prote...
Patent number
11,417,579
Issue date
Aug 16, 2022
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out electronic device
Patent number
11,410,875
Issue date
Aug 9, 2022
Texas Instruments Incorporated
Hau Thanh Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC package with half-bridge power module
Patent number
11,387,179
Issue date
Jul 12, 2022
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package with reinforced isolation
Patent number
11,329,025
Issue date
May 10, 2022
Texas Instruments Incorporated
Vivek Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with isolated heat spreader
Patent number
11,302,615
Issue date
Apr 12, 2022
Texas Instruments Incorporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded die packaging with integrated ceramic substrate
Patent number
11,183,460
Issue date
Nov 23, 2021
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress buffer layer in embedded package
Patent number
11,183,441
Issue date
Nov 23, 2021
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded die package multichip module
Patent number
11,158,595
Issue date
Oct 26, 2021
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with stacked power stage and integrated control die
Patent number
11,158,567
Issue date
Oct 26, 2021
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked die semiconductor package
Patent number
11,075,147
Issue date
Jul 27, 2021
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package panel processing with integrated ceramic isolation
Patent number
11,031,332
Issue date
Jun 8, 2021
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with double-sided cooling
Patent number
10,879,155
Issue date
Dec 29, 2020
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor devices for high voltage with die edge prote...
Patent number
10,748,827
Issue date
Aug 18, 2020
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High voltage flip-chip on lead (FOL) package
Patent number
10,580,722
Issue date
Mar 3, 2020
Texas Instruments Incoporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress buffer layer in embedded package
Patent number
10,580,715
Issue date
Mar 3, 2020
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
IC PACKAGE WITH HEAT SPREADER
Publication number
20240332119
Publication date
Oct 3, 2024
TEXAS INSTRUMENTS INCORPORATED
Rongwei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER
Publication number
20240258245
Publication date
Aug 1, 2024
TEXAS INSTRUMENTS INCORPORATED
KWANG-SOO KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK
Publication number
20240222237
Publication date
Jul 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Vivek K. Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
Publication number
20240120308
Publication date
Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
Publication number
20240071892
Publication date
Feb 29, 2024
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
Publication number
20240038619
Publication date
Feb 1, 2024
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERSION MODULE
Publication number
20230413467
Publication date
Dec 21, 2023
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
Power Module with Multi-Layer Substrate and Second Insulation Layer...
Publication number
20230395514
Publication date
Dec 7, 2023
TEXAS INSTRUMENTS INCORPORATED
Kwnag-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERTER MODULE
Publication number
20230386963
Publication date
Nov 30, 2023
TEXAS INSTRUMENTS INCORPORATED
WOOCHAN KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE INTEGRATED CIRCUIT PACKAGE
Publication number
20230378022
Publication date
Nov 23, 2023
TEXAS INSTRUMENTS INCORPORATED
KWANG-SOO KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER STAGE PACKAGE INCLUDING FLEXIBLE CIRCUIT AND STACKED DIE
Publication number
20230378034
Publication date
Nov 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG
Publication number
20230245942
Publication date
Aug 3, 2023
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL INTEGRATED CIRCUIT HA...
Publication number
20230207420
Publication date
Jun 29, 2023
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERTER MODULE
Publication number
20230198422
Publication date
Jun 22, 2023
TEXAS INSTRUMENTS INCORPORATED
WOOCHAN KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC PACKAGE WITH HEAT SPREADER
Publication number
20230187306
Publication date
Jun 15, 2023
TEXAS INSTRUMENTS INCORPORATED
Rongwei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK
Publication number
20230119127
Publication date
Apr 20, 2023
TEXAS INSTRUMENTS INCORPORATED
Vivek K. Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERTER MODULE
Publication number
20230060830
Publication date
Mar 2, 2023
TEXAS INSTRUMENTS INCORPORATED
WOOCHAN KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL INTERPOSER
Publication number
20230059142
Publication date
Feb 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Vivek Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND PROCESSES
Publication number
20230047555
Publication date
Feb 16, 2023
TEXAS INSTRUMENTS INCORPORATED
KEN PHAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH TOPSIDE COOLING
Publication number
20230015323
Publication date
Jan 19, 2023
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE WITH REINFORCED ISOLATION
Publication number
20220271008
Publication date
Aug 25, 2022
TEXAS INSTRUMENTS INCORPORATED
Vivek Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER
Publication number
20220238424
Publication date
Jul 28, 2022
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE
Publication number
20220108955
Publication date
Apr 7, 2022
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERSION MODULE
Publication number
20220029519
Publication date
Jan 27, 2022
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
MULTI-CHIP PACKAGE WITH REINFORCED ISOLATION
Publication number
20210305207
Publication date
Sep 30, 2021
TEXAS INSTRUMENTS INCORPORATED
Vivek Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Panel Processing With Integrated Ceramic Isolation
Publication number
20210280512
Publication date
Sep 9, 2021
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER
Publication number
20210202357
Publication date
Jul 1, 2021
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect Structure for High Power GaN Module
Publication number
20210175195
Publication date
Jun 10, 2021
TEXAS INSTRUMENTS INCORPORATED
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC PACKAGE WITH HALF-BRIDGE POWER MODULE
Publication number
20210175165
Publication date
Jun 10, 2021
TEXAS INSTRUMENTS INCORPORATED
MAKOTO SHIBUYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRAME DESIGN IN EMBEDDED DIE PACKAGE
Publication number
20210134729
Publication date
May 6, 2021
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS