Woodong Lee

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Cheonan-si, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP
- Publication number 20220278010
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20120315726
- Publication date Dec 13, 2012
- HAK-KYOON BYUN
- H01 - BASIC ELECTRIC ELEMENTS