WOOJIN JANG

Person

HWASEONG-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 12,199,038
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices having improved contact plug structures...
- Patent number 12,176,287
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Won Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods of manufacturing the same
- Patent number 12,048,158
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Bio Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices having improved contact plug structures...
- Patent number 11,908,798
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Won Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including via structures having a via portion...
- Patent number 11,728,268
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of integrated circuit semiconductor device
- Patent number 11,393,753
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Jungha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods of manufacturing the same
- Patent number 11,329,063
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Bio Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and methods for fabricating the same
- Patent number 10,685,972
- Issue date Jun 16, 2020
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a vertical pillar connected to the subs...
- Patent number 10,103,170
- Issue date Oct 16, 2018
- Samsung Electronics Co., Ltd.
- Byong-hyun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal interconnections
- Patent number 9,257,389
- Issue date Feb 9, 2016
- Samsung Electronics Co., Ltd.
- WooJin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal interconnections of semiconductor device
- Patent number 8,828,865
- Issue date Sep 9, 2014
- Samsung Electronics Co., Ltd.
- WooJin Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLANT TUBE BLOCK ASSEMBLY AND SEMICONDUCTOR PROCESSING DEVICE INC...
- Publication number 20240379334
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Woojin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING IMPROVED CONTACT PLUG STRUCTURES...
- Publication number 20240145388
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Won Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20230343707
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRI...
- Publication number 20230087072
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Sangmin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, METHODS OF MANUFACTURING THE SAME, AND ELECT...
- Publication number 20230066186
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Sangmin Kang
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECTION STRUCTURE OF INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20220352071
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- Jungha LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20220238439
- Publication date Jul 28, 2022
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220238555
- Publication date Jul 28, 2022
- SAMSUNG ELECTRONICS CO., LTD.
- Bio KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING IMPROVED CONTACT PLUG STRUCTURES...
- Publication number 20220199526
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- Won Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20210159174
- Publication date May 27, 2021
- Samsung Electronics Co., Ltd.
- Jungha LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210036012
- Publication date Feb 4, 2021
- Samsung Electronics Co., Ltd.
- Bio KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180114794
- Publication date Apr 26, 2018
- Samsung Electronics Co., Ltd.
- Byong-hyun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20170287929
- Publication date Oct 5, 2017
- Sunggil KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METAL INTERCONNECTIONS OF SEMICONDUCTOR DEVICE
- Publication number 20160104680
- Publication date Apr 14, 2016
- Samsung Electronics Co., Ltd.
- WOOJIN JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METAL INTERCONNECTIONS OF SEMICONDUCTOR DEVICE
- Publication number 20140339701
- Publication date Nov 20, 2014
- WooJin JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METAL INTERCONNECTIONS OF SEMICONDUCTOR DEVICE
- Publication number 20120252208
- Publication date Oct 4, 2012
- WooJin Jang
- H01 - BASIC ELECTRIC ELEMENTS

WOOJIN JANG

Person

Patents Grantslast 30 patents

Semiconductor devices and methods of fabricating the same

Integrated circuit devices having improved contact plug structures...

Vertical memory devices and methods of manufacturing the same

Integrated circuit devices having improved contact plug structures...

Semiconductor devices including via structures having a via portion...

Interconnection structure of integrated circuit semiconductor device

Vertical memory devices and methods of manufacturing the same

Semiconductor memory devices and methods for fabricating the same

Semiconductor device having a vertical pillar connected to the subs...

Semiconductor device having metal interconnections

Method of forming metal interconnections of semiconductor device

Patents Applicationslast 30 patents

COOLANT TUBE BLOCK ASSEMBLY AND SEMICONDUCTOR PROCESSING DEVICE INC...

INTEGRATED CIRCUIT DEVICES HAVING IMPROVED CONTACT PLUG STRUCTURES...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRI...

SEMICONDUCTOR DEVICES, METHODS OF MANUFACTURING THE SAME, AND ELECT...

INTERCONNECTION STRUCTURE OF INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICES HAVING IMPROVED CONTACT PLUG STRUCTURES...

INTERCONNECTION STRUCTURE OF INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME

METHOD OF FORMING METAL INTERCONNECTIONS OF SEMICONDUCTOR DEVICE

METHOD OF FORMING METAL INTERCONNECTIONS OF SEMICONDUCTOR DEVICE

METHOD OF FORMING METAL INTERCONNECTIONS OF SEMICONDUCTOR DEVICE