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Woon-Seong Kwon
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Cupertino, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package for high bandwidth memory
Patent number
11,990,461
Issue date
May 21, 2024
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and heat distribution devices for thermal management of chi...
Patent number
11,990,386
Issue date
May 21, 2024
Google LLC
Madhusudan K. Iyengar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
ASIC package with photonics and vertical power delivery
Patent number
11,978,721
Issue date
May 7, 2024
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional IC package with thermal enhancement
Patent number
11,967,538
Issue date
Apr 23, 2024
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling electronic devices in a data center
Patent number
11,832,396
Issue date
Nov 28, 2023
Google LLC
Madhusudan Krishnan Iyengar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside integrated voltage regulator for integrated circuits
Patent number
11,830,855
Issue date
Nov 28, 2023
Google LLC
Namhoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Deep trench capacitors embedded in package substrate
Patent number
11,784,215
Issue date
Oct 10, 2023
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and heat distribution devices for thermal management of chi...
Patent number
11,600,548
Issue date
Mar 7, 2023
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package for high bandwidth memory
Patent number
11,488,944
Issue date
Nov 1, 2022
Google LLC
Namhoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside integrated voltage regulator for integrated circuits
Patent number
11,276,668
Issue date
Mar 15, 2022
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit substrate for containing liquid adhesive bleed-out
Patent number
11,264,295
Issue date
Mar 1, 2022
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
ASIC package with photonics and vertical power delivery
Patent number
11,264,358
Issue date
Mar 1, 2022
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level fan-out application specific integrated circuit bridge...
Patent number
10,930,592
Issue date
Feb 23, 2021
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Massive deep trench capacitor die fill for high performance applica...
Patent number
10,896,873
Issue date
Jan 19, 2021
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit substrate for containing liquid adhesive bleed-out
Patent number
10,818,567
Issue date
Oct 27, 2020
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling electronic devices in a data center
Patent number
10,681,846
Issue date
Jun 9, 2020
Google LLC
Madhusudan Krishnan Iyengar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High bandwidth memory package for high performance processors
Patent number
10,658,322
Issue date
May 19, 2020
Google LLC
Woon Seong Kwon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and mechanisms for reducing warpage and increasing surfac...
Patent number
10,643,913
Issue date
May 5, 2020
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling electronic devices in a data center
Patent number
10,548,239
Issue date
Jan 28, 2020
Google LLC
Madhusudan Krishnan Iyengar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Cooling electronic devices in a data center
Patent number
10,548,240
Issue date
Jan 28, 2020
Google LLC
Madhusudan Krishnan Iyengar
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
High bandwidth memory package for high performance processors
Patent number
10,515,920
Issue date
Dec 24, 2019
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip silicon substrate-less chip packaging
Patent number
10,468,351
Issue date
Nov 5, 2019
Xilinx, Inc.
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stiffener for protecting semiconductor die
Patent number
10,468,359
Issue date
Nov 5, 2019
Google LLC
William Edwards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded air gap transmission lines
Patent number
10,257,921
Issue date
Apr 9, 2019
Google LLC
Richard Roy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stiffener for protecting semiconductor die
Patent number
10,083,920
Issue date
Sep 25, 2018
Google LLC
William Edwards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integration of silicon photonics IC for high data rate
Patent number
10,025,047
Issue date
Jul 17, 2018
Google LLC
Hong Liu
G02 - OPTICS
Information
Patent Grant
Protective barrier for integrated circuit packages housing a voltag...
Patent number
9,966,345
Issue date
May 8, 2018
Google LLC
Gregory Sizikov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for molded underfill for integrated circuit dies
Patent number
9,831,104
Issue date
Nov 28, 2017
Xilinx, Inc.
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer with edge reinforcement and method for manufacturing same
Patent number
9,627,329
Issue date
Apr 18, 2017
Xilinx, Inc.
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for flip chip stacking
Patent number
9,508,563
Issue date
Nov 29, 2016
Xilinx, Inc.
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Trans-Inductor Voltage Regulator For High Bandwidth Power Delivery
Publication number
20240120847
Publication date
Apr 11, 2024
Google LLC
Shuai Jiang
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
Socket To Support High Performance Multi-die ASICs
Publication number
20240096859
Publication date
Mar 21, 2024
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE
Publication number
20230420494
Publication date
Dec 28, 2023
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Active Silicon D2D Bridge
Publication number
20230411297
Publication date
Dec 21, 2023
Google LLC
Georgios Konstadinidis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
Publication number
20230402430
Publication date
Dec 14, 2023
Google LLC
Namhoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE FOR OPTIMAL XPU SOCKET COMPRESSION
Publication number
20230335928
Publication date
Oct 19, 2023
Google LLC
William F. Edwards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
Publication number
20230230896
Publication date
Jul 20, 2023
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Package For High Bandwidth Memory
Publication number
20230042856
Publication date
Feb 9, 2023
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three Dimensional IC Package with Thermal Enhancement
Publication number
20220328376
Publication date
Oct 13, 2022
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low Cost Package Structure For High Performance ML Memory Interface...
Publication number
20220238504
Publication date
Jul 28, 2022
Google LLC
Namhoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Backside Interconnection Interface Die For Integrated Circuits Package
Publication number
20220189934
Publication date
Jun 16, 2022
Google LLC
Namhoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
Publication number
20220157787
Publication date
May 19, 2022
Google LLC
Namhoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Asic Package With Photonics And Vertical Power Delivery
Publication number
20220139876
Publication date
May 5, 2022
Google LLC
Woon-Seong Kwon
G02 - OPTICS
Information
Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
Publication number
20210375715
Publication date
Dec 2, 2021
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
Publication number
20210378106
Publication date
Dec 2, 2021
Google LLC
Madhusudan K. Iyengar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE
Publication number
20210273042
Publication date
Sep 2, 2021
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
Publication number
20210249384
Publication date
Aug 12, 2021
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASIC PACKAGE WITH PHOTONICS AND VERTICAL POWER DELIVERY
Publication number
20210074677
Publication date
Mar 11, 2021
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Substrate For Containing Liquid Adhesive Bleed-Out
Publication number
20210074601
Publication date
Mar 11, 2021
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL FAN-OUT APPLICATION SPECIFIC INTEGRATED CIRCUIT BRIDGE...
Publication number
20200357743
Publication date
Nov 12, 2020
Google LLC
Nam Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
Publication number
20200296862
Publication date
Sep 17, 2020
Google LLC
Madhusudan Krishnan Iyengar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED CIRCUIT SUBSTRATE FOR CONTAINING LIQUID ADHESIVE BLEED-OUT
Publication number
20200185292
Publication date
Jun 11, 2020
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MASSIVE DEEP TRENCH CAPACITOR DIE FILL FOR HIGH PERFORMANCE APPLICA...
Publication number
20200161235
Publication date
May 21, 2020
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Bandwidth Memory Package For High Performance Processors
Publication number
20200098715
Publication date
Mar 26, 2020
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
Publication number
20190327859
Publication date
Oct 24, 2019
Google LLC
Madhusudan Krishnan Iyengar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HIGH BANDWIDTH MEMORY PACKAGE FOR HIGH PERFORMANCE PROCESSORS
Publication number
20190312002
Publication date
Oct 10, 2019
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND MECHANISMS FOR REDUCING WARPAGE AND INCREASING SURFAC...
Publication number
20190172767
Publication date
Jun 6, 2019
Google LLC
Woon Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATION OF SILICON PHOTONICS IC FOR HIGH DATA RATE
Publication number
20180299628
Publication date
Oct 18, 2018
Google LLC
Hong Liu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-CHIP SILICON SUBSTRATE-LESS CHIP PACKAGING
Publication number
20160064328
Publication date
Mar 3, 2016
Xilinx, Inc.
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER CORE ORGANIC PACKAGE SUBSTRATE
Publication number
20140262440
Publication date
Sep 18, 2014
Xilinx, Inc.
Namhoon Kim
H01 - BASIC ELECTRIC ELEMENTS