Woon-Seong Kwon

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,243,802
- Issue date Mar 4, 2025
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside interconnection interface die for integrated circuits package
- Patent number 12,051,679
- Issue date Jul 30, 2024
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for high bandwidth memory
- Patent number 11,990,461
- Issue date May 21, 2024
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,978,721
- Issue date May 7, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional IC package with thermal enhancement
- Patent number 11,967,538
- Issue date Apr 23, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside integrated voltage regulator for integrated circuits
- Patent number 11,830,855
- Issue date Nov 28, 2023
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 11,832,396
- Issue date Nov 28, 2023
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 11,784,215
- Issue date Oct 10, 2023
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,600,548
- Issue date Mar 7, 2023
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for high bandwidth memory
- Patent number 11,488,944
- Issue date Nov 1, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside integrated voltage regulator for integrated circuits
- Patent number 11,276,668
- Issue date Mar 15, 2022
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate for containing liquid adhesive bleed-out
- Patent number 11,264,295
- Issue date Mar 1, 2022
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,264,358
- Issue date Mar 1, 2022
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level fan-out application specific integrated circuit bridge...
- Patent number 10,930,592
- Issue date Feb 23, 2021
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massive deep trench capacitor die fill for high performance applica...
- Patent number 10,896,873
- Issue date Jan 19, 2021
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate for containing liquid adhesive bleed-out
- Patent number 10,818,567
- Issue date Oct 27, 2020
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,681,846
- Issue date Jun 9, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth memory package for high performance processors
- Patent number 10,658,322
- Issue date May 19, 2020
- Google LLC
- Woon Seong Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and mechanisms for reducing warpage and increasing surfac...
- Patent number 10,643,913
- Issue date May 5, 2020
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,548,239
- Issue date Jan 28, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,548,240
- Issue date Jan 28, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High bandwidth memory package for high performance processors
- Patent number 10,515,920
- Issue date Dec 24, 2019
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip silicon substrate-less chip packaging
- Patent number 10,468,351
- Issue date Nov 5, 2019
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stiffener for protecting semiconductor die
- Patent number 10,468,359
- Issue date Nov 5, 2019
- Google LLC
- William Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded air gap transmission lines
- Patent number 10,257,921
- Issue date Apr 9, 2019
- Google LLC
- Richard Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stiffener for protecting semiconductor die
- Patent number 10,083,920
- Issue date Sep 25, 2018
- Google LLC
- William Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of silicon photonics IC for high data rate
- Patent number 10,025,047
- Issue date Jul 17, 2018
- Google LLC
- Hong Liu
- G02 - OPTICS
Information Patent Grant
Protective barrier for integrated circuit packages housing a voltag...
- Patent number 9,966,345
- Issue date May 8, 2018
- Google LLC
- Gregory Sizikov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20250006706
- Publication date Jan 2, 2025
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20240213215
- Publication date Jun 27, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional IC Package with Thermal Enhancement
- Publication number 20240186214
- Publication date Jun 6, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trans-Inductor Voltage Regulator For High Bandwidth Power Delivery
- Publication number 20240120847
- Publication date Apr 11, 2024
- Google LLC
- Shuai Jiang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Socket To Support High Performance Multi-die ASICs
- Publication number 20240096859
- Publication date Mar 21, 2024
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE
- Publication number 20230420494
- Publication date Dec 28, 2023
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active Silicon D2D Bridge
- Publication number 20230411297
- Publication date Dec 21, 2023
- Google LLC
- Georgios Konstadinidis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20230402430
- Publication date Dec 14, 2023
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR OPTIMAL XPU SOCKET COMPRESSION
- Publication number 20230335928
- Publication date Oct 19, 2023
- Google LLC
- William F. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20230230896
- Publication date Jul 20, 2023
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package For High Bandwidth Memory
- Publication number 20230042856
- Publication date Feb 9, 2023
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional IC Package with Thermal Enhancement
- Publication number 20220328376
- Publication date Oct 13, 2022
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost Package Structure For High Performance ML Memory Interface...
- Publication number 20220238504
- Publication date Jul 28, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Interconnection Interface Die For Integrated Circuits Package
- Publication number 20220189934
- Publication date Jun 16, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20220157787
- Publication date May 19, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20220139876
- Publication date May 5, 2022
- Google LLC
- Woon-Seong Kwon
- G02 - OPTICS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20210375715
- Publication date Dec 2, 2021
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20210378106
- Publication date Dec 2, 2021
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE
- Publication number 20210273042
- Publication date Sep 2, 2021
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20210249384
- Publication date Aug 12, 2021
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASIC PACKAGE WITH PHOTONICS AND VERTICAL POWER DELIVERY
- Publication number 20210074677
- Publication date Mar 11, 2021
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Substrate For Containing Liquid Adhesive Bleed-Out
- Publication number 20210074601
- Publication date Mar 11, 2021
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FAN-OUT APPLICATION SPECIFIC INTEGRATED CIRCUIT BRIDGE...
- Publication number 20200357743
- Publication date Nov 12, 2020
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
- Publication number 20200296862
- Publication date Sep 17, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE FOR CONTAINING LIQUID ADHESIVE BLEED-OUT
- Publication number 20200185292
- Publication date Jun 11, 2020
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASSIVE DEEP TRENCH CAPACITOR DIE FILL FOR HIGH PERFORMANCE APPLICA...
- Publication number 20200161235
- Publication date May 21, 2020
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Bandwidth Memory Package For High Performance Processors
- Publication number 20200098715
- Publication date Mar 26, 2020
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
- Publication number 20190327859
- Publication date Oct 24, 2019
- Google LLC
- Madhusudan Krishnan Iyengar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH BANDWIDTH MEMORY PACKAGE FOR HIGH PERFORMANCE PROCESSORS
- Publication number 20190312002
- Publication date Oct 10, 2019
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Woon-Seong Kwon

Person

Patents Grantslast 30 patents

Methods and heat distribution devices for thermal management of chi...

Deep trench capacitors embedded in package substrate

Backside interconnection interface die for integrated circuits package

Integrated circuit package for high bandwidth memory

Methods and heat distribution devices for thermal management of chi...

ASIC package with photonics and vertical power delivery

Three dimensional IC package with thermal enhancement

Backside integrated voltage regulator for integrated circuits

Cooling electronic devices in a data center

Deep trench capacitors embedded in package substrate

Methods and heat distribution devices for thermal management of chi...

Integrated circuit package for high bandwidth memory

Backside integrated voltage regulator for integrated circuits

Integrated circuit substrate for containing liquid adhesive bleed-out

ASIC package with photonics and vertical power delivery

Wafer level fan-out application specific integrated circuit bridge...

Massive deep trench capacitor die fill for high performance applica...

Integrated circuit substrate for containing liquid adhesive bleed-out

Cooling electronic devices in a data center

High bandwidth memory package for high performance processors

Apparatus and mechanisms for reducing warpage and increasing surfac...

Cooling electronic devices in a data center

Cooling electronic devices in a data center

High bandwidth memory package for high performance processors

Multi-chip silicon substrate-less chip packaging

Package stiffener for protecting semiconductor die

Embedded air gap transmission lines

Package stiffener for protecting semiconductor die

Integration of silicon photonics IC for high data rate

Protective barrier for integrated circuit packages housing a voltag...

Patents Applicationslast 30 patents

Backside Integrated Voltage Regulator For Integrated Circuits

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Asic Package With Photonics And Vertical Power Delivery

Three Dimensional IC Package with Thermal Enhancement

Trans-Inductor Voltage Regulator For High Bandwidth Power Delivery

Socket To Support High Performance Multi-die ASICs

DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE

Active Silicon D2D Bridge

Backside Integrated Voltage Regulator For Integrated Circuits

STRUCTURE FOR OPTIMAL XPU SOCKET COMPRESSION

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Integrated Circuit Package For High Bandwidth Memory

Three Dimensional IC Package with Thermal Enhancement

Low Cost Package Structure For High Performance ML Memory Interface...

Backside Interconnection Interface Die For Integrated Circuits Package

Backside Integrated Voltage Regulator For Integrated Circuits

Asic Package With Photonics And Vertical Power Delivery

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Methods And Heat Distribution Devices For Thermal Management Of Chi...

DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE

Backside Integrated Voltage Regulator For Integrated Circuits

ASIC PACKAGE WITH PHOTONICS AND VERTICAL POWER DELIVERY

Integrated Circuit Substrate For Containing Liquid Adhesive Bleed-Out

WAFER LEVEL FAN-OUT APPLICATION SPECIFIC INTEGRATED CIRCUIT BRIDGE...

COOLING ELECTRONIC DEVICES IN A DATA CENTER

INTEGRATED CIRCUIT SUBSTRATE FOR CONTAINING LIQUID ADHESIVE BLEED-OUT

MASSIVE DEEP TRENCH CAPACITOR DIE FILL FOR HIGH PERFORMANCE APPLICA...

High Bandwidth Memory Package For High Performance Processors

COOLING ELECTRONIC DEVICES IN A DATA CENTER

HIGH BANDWIDTH MEMORY PACKAGE FOR HIGH PERFORMANCE PROCESSORS