Woon seong Kwon

Person

Taejon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,852,988
- Issue date Oct 7, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,466,527
- Issue date Jun 18, 2013
- Samsung Electronics Co., Ltd.
- Hyung-Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera modules and methods of fabricating the same
- Patent number 8,114,701
- Issue date Feb 14, 2012
- Samsung Electronics Co., Ltd.
- Woon-Seong Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module and electronic apparatus having the same
- Patent number 7,948,555
- Issue date May 24, 2011
- Samsung Electronics Co., Ltd.
- Yong Hwan Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor package, method of manufacturing the same, and image s...
- Patent number 7,893,514
- Issue date Feb 22, 2011
- Samsung Electronics Co., Ltd.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having through via
- Patent number 7,884,392
- Issue date Feb 8, 2011
- Hyuek-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having an even coati...
- Patent number 7,786,581
- Issue date Aug 31, 2010
- Samsung Electronics Co., Ltd.
- Un Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor chip package having different type of chip...
- Patent number 7,619,315
- Issue date Nov 17, 2009
- Samsung Electronics Co., Ltd.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing conductive adhesive for high frequency fli...
- Patent number 6,514,560
- Issue date Feb 4, 2003
- Korea Advanced Institute of Science and Technology
- Kyung wook Paik
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130267057
- Publication date Oct 10, 2013
- Hyung-Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110180892
- Publication date Jul 28, 2011
- SAMSUNG ELETRONICS CO., LTD.
- Hyung-Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATI...
- Publication number 20100320500
- Publication date Dec 23, 2010
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING DIFFERENT TYPE OF CHIP...
- Publication number 20100019338
- Publication date Jan 28, 2010
- Samsung Electronics Co., Ltd.
- Woon-Seong KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Camera module, method of manufacturing the same, and electronic sys...
- Publication number 20090256931
- Publication date Oct 15, 2009
- Samsung Electronics Co., Ltd.
- Chung-Sun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR HAVING THROUGH VIA
- Publication number 20090200632
- Publication date Aug 13, 2009
- Samsung Electronics Co., Ltd.
- Hyuek-Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULES AND METHODS OF FABRICATING THE SAME
- Publication number 20090130791
- Publication date May 21, 2009
- Samsung Electronics Co., Ltd.
- Woon-Seong KWON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE AND ELECTRONIC APPARATUS HAVING THE SAME
- Publication number 20090122178
- Publication date May 14, 2009
- Samsung Electronics Co., Ltd.
- Yong-Hwan Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA AND RELATED METHOD O...
- Publication number 20080284041
- Publication date Nov 20, 2008
- Samsung Electronics Co., Ltd.
- Hyung-sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device having an even coati...
- Publication number 20080258299
- Publication date Oct 23, 2008
- Un Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND IMAGE S...
- Publication number 20080251872
- Publication date Oct 16, 2008
- Samsung Electronics Co., Ltd.
- Woon-Seong KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING DIFFERENT TYPE OF CHIP...
- Publication number 20080169546
- Publication date Jul 17, 2008
- Samsung Electronics Co., Ltd.
- Woon-Seong KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING T...
- Publication number 20080083983
- Publication date Apr 10, 2008
- Samsung Electronics Co., Ltd.
- Hyang-sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE, RELATED METHOD OF MANUFACTURE AND IMAGE SENSO...
- Publication number 20080055438
- Publication date Mar 6, 2008
- Samsung Electronics Co., Ltd.
- Chung-Sun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICAT...
- Publication number 20080054456
- Publication date Mar 6, 2008
- Samsung Electronics Co., Ltd.
- Un-byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package and method of fabricating the same
- Publication number 20080012084
- Publication date Jan 17, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Yong-Hwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing conductive adhesive for high frequency fli...
- Publication number 20020111423
- Publication date Aug 15, 2002
- Korea Advanced Institute of Science and Technology
- Kyung wook Paik
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Woon seong Kwon

Person

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Camera modules and methods of fabricating the same

Camera module and electronic apparatus having the same

Image sensor package, method of manufacturing the same, and image s...

Image sensor having through via

Method of manufacturing a semiconductor device having an even coati...

Stack type semiconductor chip package having different type of chip...

Method for manufacturing conductive adhesive for high frequency fli...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATI...

STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING DIFFERENT TYPE OF CHIP...

Camera module, method of manufacturing the same, and electronic sys...

IMAGE SENSOR HAVING THROUGH VIA

CAMERA MODULES AND METHODS OF FABRICATING THE SAME

CAMERA MODULE AND ELECTRONIC APPARATUS HAVING THE SAME

SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA AND RELATED METHOD O...

Method of manufacturing a semiconductor device having an even coati...

IMAGE SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND IMAGE S...

STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING DIFFERENT TYPE OF CHIP...

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING T...

IMAGE SENSOR PACKAGE, RELATED METHOD OF MANUFACTURE AND IMAGE SENSO...

SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICAT...

Image sensor package and method of fabricating the same

Method for manufacturing conductive adhesive for high frequency fli...