Woon Yik Yong

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package with high voltage isolation
- Patent number 11,817,407
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with leadframe interconnection structure
- Patent number 11,444,011
- Issue date Sep 13, 2022
- Infineon Technologies AG
- Woon Yik Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with high voltage isolation
- Patent number 11,355,460
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with leadframe interconnection structure
- Patent number 10,872,848
- Issue date Dec 22, 2020
- Infineon Technologies AG
- Woon Yik Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for an electronic package with a fail-open mechanism
- Patent number 9,082,737
- Issue date Jul 14, 2015
- Infineon Technologies AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Leadframe Interconnection Structure
- Publication number 20210066172
- Publication date Mar 4, 2021
- INFINEON TECHNOLOGIES AG
- Woon Yik Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Leadframe Interconnection Structure
- Publication number 20200135626
- Publication date Apr 30, 2020
- INFINEON TECHNOLOGIES AG
- Woon Yik Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Electronic Package with a Fail-Open Mechanism
- Publication number 20140131844
- Publication date May 15, 2014
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS