Woonbae Kim

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Tray support structure and electronic device including the same
- Patent number 12,262,496
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Sukchul Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package including image sensor chip, transparent subs...
- Patent number 12,261,181
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Woonbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including image sensor chip, transparent subs...
- Patent number 11,581,348
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Woonbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package, method of manufacturing the same, and method of man...
- Patent number 11,131,568
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Sungeun Jo
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device including slidable body
- Patent number 10,944,853
- Issue date Mar 9, 2021
- Samsung Electronics Co., Ltd.
- Younghoon Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fingerprint sensor package and display apparatus including the same
- Patent number 10,776,601
- Issue date Sep 15, 2020
- Samsung Electronics Co., Ltd.
- Woonbae Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor package, method of manufacturing the same, and method of man...
- Patent number 10,760,930
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Sungeun Jo
- G01 - MEASURING TESTING
Information Patent Grant
Film product, film packages and package modules using the same
- Patent number 10,304,764
- Issue date May 28, 2019
- Samsung Electronics Co., Ltd.
- Yechung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing module substrate and sensing module including the same
- Patent number 10,282,587
- Issue date May 7, 2019
- Samsung Electronics Co., Ltd.
- Inho Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages
- Patent number 9,601,445
- Issue date Mar 21, 2017
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20250087562
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Narae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321902
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Narae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20240162213
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014092
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- YECHUNG CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING DISPLAY MODULE
- Publication number 20230239388
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Chulhwan LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING IMAGE SENSOR CHIP
- Publication number 20230197747
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- WOONBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAY SUPPORT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230127496
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Sukchul PARK
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220367553
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Kyungkyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING IMAGE SENSOR CHIP
- Publication number 20210050377
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- WOONBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MAN...
- Publication number 20200386585
- Publication date Dec 10, 2020
- Samsung Electronics Co., Ltd.
- Sungeun JO
- G01 - MEASURING TESTING
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20200372232
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Woonbae KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE INCLUDING SLIDABLE BODY
- Publication number 20200358887
- Publication date Nov 12, 2020
- Samsung Electronics Co., Ltd.
- Younghoon LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20190213373
- Publication date Jul 11, 2019
- Samsung Electronics Co., Ltd.
- Woonbae KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MAN...
- Publication number 20190186960
- Publication date Jun 20, 2019
- Samsung Electronics Co., Ltd.
- Sungeun JO
- G01 - MEASURING TESTING
Information Patent Application
FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME
- Publication number 20170372992
- Publication date Dec 28, 2017
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING MODULE SUBSTRATE AND SENSING MODULE INCLUDING THE SAME
- Publication number 20170235997
- Publication date Aug 17, 2017
- Samsung Electronics Co., Ltd.
- Inho CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Packages
- Publication number 20160148881
- Publication date May 26, 2016
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS

Woonbae Kim

Person

Patents Grantslast 30 patents

Tray support structure and electronic device including the same

Semiconductor package including image sensor chip, transparent subs...

Semiconductor package including image sensor chip, transparent subs...

Sensor package, method of manufacturing the same, and method of man...

Electronic device including slidable body

Fingerprint sensor package and display apparatus including the same

Sensor package, method of manufacturing the same, and method of man...

Film product, film packages and package modules using the same

Sensing module substrate and sensing module including the same

Semiconductor packages

Patents Applicationslast 30 patents

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE COMPRISING DISPLAY MODULE

SEMICONDUCTOR PACKAGE INCLUDING IMAGE SENSOR CHIP

TRAY SUPPORT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING IMAGE SENSOR CHIP

SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MAN...

FINGERPRINT SENSOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

ELECTRONIC DEVICE INCLUDING SLIDABLE BODY

FINGERPRINT SENSOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MAN...

FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME

SENSING MODULE SUBSTRATE AND SENSING MODULE INCLUDING THE SAME

Semiconductor Packages