WoonJae Beak

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Cheongju-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming an integrated SiP module...
- Patent number 11,367,690
- Issue date Jun 21, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP module over film layer
- Patent number 11,309,193
- Issue date Apr 19, 2022
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming SIP module over film layer
- Patent number 10,804,119
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an integrated SIP module...
- Patent number 10,700,011
- Issue date Jun 30, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with plated copper posts and me...
- Patent number 9,693,455
- Issue date Jun 27, 2017
- STATS ChipPAC Pte. Ltd.
- Seong Won Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
- Publication number 20200402817
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Integrated SIP Module...
- Publication number 20200286835
- Publication date Sep 10, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
- Publication number 20180269195
- Publication date Sep 20, 2018
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Integrated SIP Module...
- Publication number 20180158779
- Publication date Jun 7, 2018
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS