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Hsinchu, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked chip package structure with leadframe having bus bar
Patent number
8,212,347
Issue date
Jul 3, 2012
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package structure with leadframe having inner leads wi...
Patent number
8,207,603
Issue date
Jun 26, 2012
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package structure with leadframe having bus bar
Patent number
8,169,061
Issue date
May 1, 2012
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC package reducing wiring layers on substrate and its carrier
Patent number
8,026,615
Issue date
Sep 27, 2011
ChipMOS Technologies Inc.
Hung Tsun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package having asymmetric molding
Patent number
7,834,432
Issue date
Nov 16, 2010
ChipMOS Technologies Inc.
Wu-Chang Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package structure with leadframe having inner leads wi...
Patent number
7,816,771
Issue date
Oct 19, 2010
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package structure with leadframe having bus bar
Patent number
7,786,595
Issue date
Aug 31, 2010
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC package reducing wiring layers on substrate and its chip carrier
Patent number
7,781,898
Issue date
Aug 24, 2010
ChipMOS Technologies Inc.
Hung-Tsun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-stacked package structure having leadframe with multi-piece bu...
Patent number
7,615,853
Issue date
Nov 10, 2009
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package having with asymmetric molding and turbulent plate dow...
Patent number
7,576,416
Issue date
Aug 18, 2009
ChipMOS Technologies Inc.
Wu-Chang Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High frequency IC package and method for fabricating the same
Patent number
7,554,197
Issue date
Jun 30, 2009
Chipmos Technologies (Bermuda) Ltd.
Hsiang-Ming Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Stacked Chip Package Structure with Leadframe Having Inner Leads wi...
Publication number
20100314729
Publication date
Dec 16, 2010
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Chip Package Structure with Leadframe Having Bus Bar
Publication number
20100264527
Publication date
Oct 21, 2010
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Chip Package Structure with Leadframe Having Bus Bar
Publication number
20100264530
Publication date
Oct 21, 2010
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC Package Reducing Wiring Layers on Substrate and Its Carrier
Publication number
20100264540
Publication date
Oct 21, 2010
CHIPMOS TECHNOLOGIES INC.
Hung Tsun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bu...
Publication number
20100006997
Publication date
Jan 14, 2010
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE HAVING ASYMMETRIC MOLDING
Publication number
20090243056
Publication date
Oct 1, 2009
CHIPMOS TECHNOLOGIES INC.
Wu-Chang Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip package reducing wiring layers on substrate and its carrier
Publication number
20080174031
Publication date
Jul 24, 2008
ChipMOS TECHNOLOGIES INC.
Hung-Tsun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked chip package structure with leadframe having inner leads wi...
Publication number
20080099896
Publication date
May 1, 2008
ChipMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip-stacked package structure for lead frame having bus bars with...
Publication number
20080061411
Publication date
Mar 13, 2008
ChipMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked chip package structure with leadframe having bus bar
Publication number
20080061421
Publication date
Mar 13, 2008
ChipMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip-stacked package structure with leadframe having multi-piece bu...
Publication number
20080061412
Publication date
Mar 13, 2008
ChipMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High frequency IC package and method for fabricating the same
Publication number
20070235871
Publication date
Oct 11, 2007
ChipMOS Technologies (Bermuda) Ltd.
Hsiang-Ming Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNIVERSAL CHIP PACKAGE STRUCTURE
Publication number
20070228581
Publication date
Oct 4, 2007
Shih-Wen Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip package having asymmetric molding
Publication number
20070085176
Publication date
Apr 19, 2007
Wu-Chang Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Universal chip package structure
Publication number
20070080466
Publication date
Apr 12, 2007
Shih-Wen Chou
H01 - BASIC ELECTRIC ELEMENTS