Wu-Chang Wang

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Substrate structure and manufacturing process
- Patent number 11,189,610
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Li-Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 7,078,798
- Issue date Jul 18, 2006
- Advanced Semiconductor Engineering, Inc.
- Wu-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor substrate
- Patent number 6,252,309
- Issue date Jun 26, 2001
- Advanced Semiconductor Engineering, Inc.
- Wu-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging device
- Patent number 5,982,625
- Issue date Nov 9, 1999
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING PROCESS
- Publication number 20200006315
- Publication date Jan 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Li-Chuan TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SLOT ON SUBSTRATE AND STRUCTURE THEREOF
- Publication number 20080263852
- Publication date Oct 30, 2008
- Advanced Semiconductor Engineering, Inc.
- Shih-ching Chang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20030234445
- Publication date Dec 25, 2003
- Advanced Semiconductor Engineering, Inc.
- Wu-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS