Wu Leon

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and topology for improving signal quality on high speed, mul...
- Patent number 7,106,094
- Issue date Sep 12, 2006
- International Business Machines Corporation
- Edmund S. Gamble
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Synchronizer for a source synchronized clock bus with multiple agents
- Patent number 6,661,859
- Issue date Dec 9, 2003
- International Business Machines Corporation
- Leon Li-Heng Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Driver circuit having shapable transition waveforms
- Patent number 6,525,569
- Issue date Feb 25, 2003
- International Business Machines Corporation
- Wu Leon
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing a package structure having a heat spreader...
- Patent number 6,162,659
- Issue date Dec 19, 2000
- International Business Machines Corporation
- Leon Li-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing disturbances on an integrated cir...
- Patent number 5,828,259
- Issue date Oct 27, 1998
- International Business Machines Corporation
- Moises Cases
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic ball grid array (CBGA) package structure having a heat spre...
- Patent number 5,777,385
- Issue date Jul 7, 1998
- International Business Machines Corporation
- Leon Li-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical chip mount memory package and method
- Patent number 5,397,747
- Issue date Mar 14, 1995
- International Business Machines Corporation
- John M. Angiulli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS voltage controlled ring oscillator
- Patent number 5,365,204
- Issue date Nov 15, 1994
- International Business Machines Corporation
- John M. Angiulli
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Vertical chip mount memory package with packaging substrate and mem...
- Patent number 5,362,986
- Issue date Nov 8, 1994
- International Business Machines Corporation
- John M. Angiulli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct write EC single metal layer
- Patent number 5,294,754
- Issue date Mar 15, 1994
- Iternational Business Machines Corporation
- Leon L. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics system with direct write engineering change capability
- Patent number 5,060,116
- Issue date Oct 22, 1991
- Warren D. Grobman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer chip technique for making engineering changes between in...
- Patent number 4,803,595
- Issue date Feb 7, 1989
- International Business Machines Corporation
- Charles J. Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered interposer board for powering high current chip modules
- Patent number 4,688,151
- Issue date Aug 18, 1987
- International Business Machines Corporation
- Charles J. Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line terminator-decoupling capacitor chip for off-chip...
- Patent number 4,553,050
- Issue date Nov 12, 1985
- International Business Machines Corporation
- Irving Feinberg
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High density wired module
- Patent number 4,535,388
- Issue date Aug 13, 1985
- International Business Machines Corporation
- Charles J. Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick film capacitor having very low internal inductance
- Patent number 4,274,124
- Issue date Jun 16, 1981
- International Business Machines Corporation
- Irving Feinberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heater element array
- Patent number 4,035,607
- Issue date Jul 12, 1977
- IBM Corporation
- Leon L. Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Integrated heater element array and fabrication method
- Patent number 3,953,264
- Issue date Apr 27, 1976
- International Business Machines Corporation
- Leon L. Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
Method and topology for improving signal quality on high speed, mul...
- Publication number 20050253621
- Publication date Nov 17, 2005
- International Business Machines Corporation
- Edmund S. Gamble
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Method and topology for improving signal quality on high speed, mul...

Synchronizer for a source synchronized clock bus with multiple agents

Driver circuit having shapable transition waveforms

Method for manufacturing a package structure having a heat spreader...

Method and apparatus for reducing disturbances on an integrated cir...

Ceramic ball grid array (CBGA) package structure having a heat spre...

Vertical chip mount memory package and method

CMOS voltage controlled ring oscillator

Vertical chip mount memory package with packaging substrate and mem...

Direct write EC single metal layer

Electronics system with direct write engineering change capability

Interposer chip technique for making engineering changes between in...

Multilayered interposer board for powering high current chip modules

Transmission line terminator-decoupling capacitor chip for off-chip...

High density wired module

Thick film capacitor having very low internal inductance

Integrated heater element array

Integrated heater element array and fabrication method

Patents Applicationslast 30 patents

Method and topology for improving signal quality on high speed, mul...