Wun-Jheng SYU

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package device having glass transition temperature gr...
- Patent number 10,734,337
- Issue date Aug 4, 2020
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,629,519
- Issue date Apr 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,573,624
- Issue date Feb 25, 2020
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device having glass transition temperature gr...
- Patent number 10,224,298
- Issue date Mar 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,157,887
- Issue date Dec 18, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,134,683
- Issue date Nov 20, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190198469
- Publication date Jun 27, 2019
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190088626
- Publication date Mar 21, 2019
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180261573
- Publication date Sep 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180233457
- Publication date Aug 16, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180151478
- Publication date May 31, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180068962
- Publication date Mar 8, 2018
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Wun-Jheng SYU

Person

Patents Grantslast 30 patents

Semiconductor package device having glass transition temperature gr...

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package device having glass transition temperature gr...

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME