TREA

Wun-Kai TSAI

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  • Huwei Township, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Arcing protection method, processing tool and fabrication system
    • Patent number 12,057,301
    • Issue date Aug 6, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Wun-Kai Tsai
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Wafer bonding method and wafer bonding apparatus
    • Patent number 11,721,662
    • Issue date Aug 8, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yun-Tai Shih
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Arcing protection method and processing tool
    • Patent number 11,664,206
    • Issue date May 30, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Wun-Kai Tsai
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Bonding alignment tool
    • Patent number 10,847,490
    • Issue date Nov 24, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yun-Tai Shih
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Bonding alignment tool
    • Patent number 10,396,054
    • Issue date Aug 27, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yun-Tai Shih
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding alignment tool and method
    • Patent number 9,123,754
    • Issue date Sep 1, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai Shih
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

  • Information Patent Application

    ARCING PROTECTION METHOD, PROCESSING TOOL AND FABRICATION SYSTEM
    • Publication number 20240363318
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Wun-Kai TSAI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ARCING PROTECTION METHOD, PROCESSING TOOL AND FABRICATION SYSTEM
    • Publication number 20230253195
    • Publication date Aug 10, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Wun-Kai TSAI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    WAFER BONDING METHOD AND WAFER BONDING APPARATUS
    • Publication number 20210050324
    • Publication date Feb 18, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai SHIH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING ALIGNMENT TOOL
    • Publication number 20190378813
    • Publication date Dec 12, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai SHIH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ARCING PROTECTION METHOD AND PROCESSING TOOL
    • Publication number 20190139746
    • Publication date May 9, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wun-Kai TSAI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    BONDING ALIGNMENT TOOL
    • Publication number 20150340337
    • Publication date Nov 26, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai SHIH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING ALIGNMENT TOOL AND METHOD
    • Publication number 20130086786
    • Publication date Apr 11, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai SHIH
    • H01 - BASIC ELECTRIC ELEMENTS