Wushing Yin

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Clinton, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated void-free process for assembling a solder bumped chip
- Patent number 6,610,559
- Issue date Aug 26, 2003
- Indium Corporation of America
- Shanger Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Integrated underfill process for bumped chip assembly
- Publication number 20050028361
- Publication date Feb 10, 2005
- INDIUM CORPORATION OF AMERICA
- Wushing Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOID-FREE PROCESS FOR ASSEMBLING A SOLDER BUMPED CHIP
- Publication number 20030096453
- Publication date May 22, 2003
- Shanger Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR