WuXing Xia

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Suzhou, CN

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Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING
- Publication number 20240090130
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Chad CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING COVERS
- Publication number 20230343739
- Publication date Oct 26, 2023
- Semiconductor Components Industries, LLC
- Wuxing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRENGTHENED WIRE-BOND
- Publication number 20220020717
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- WuXing Xia
- H01 - BASIC ELECTRIC ELEMENTS