Xia Feng

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 10,607,946
- Issue date Mar 31, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 10,204,866
- Issue date Feb 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with dummy metal protective structure around s...
- Patent number 10,163,815
- Issue date Dec 25, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer for...
- Patent number 9,754,867
- Issue date Sep 5, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 9,679,863
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 9,558,958
- Issue date Jan 31, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer for...
- Patent number 9,548,240
- Issue date Jan 17, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer with...
- Patent number 9,472,452
- Issue date Oct 18, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL over contact pad wit...
- Patent number 9,202,713
- Issue date Dec 1, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,087,930
- Issue date Jul 21, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RDL wider than contact pad along first axis and n...
- Patent number 8,962,476
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 8,907,476
- Issue date Dec 9, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer with...
- Patent number 8,786,100
- Issue date Jul 22, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective structure aro...
- Patent number 8,642,446
- Issue date Feb 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL wider than contact p...
- Patent number 8,501,618
- Issue date Aug 6, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,456,002
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer around...
- Patent number 8,409,926
- Issue date Apr 2, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer with...
- Patent number 8,343,809
- Issue date Jan 1, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 8,183,095
- Issue date May 22, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Interconnect Substrate f...
- Publication number 20170236788
- Publication date Aug 17, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20170098612
- Publication date Apr 6, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer for...
- Publication number 20170084526
- Publication date Mar 23, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer for...
- Publication number 20150155248
- Publication date Jun 4, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20150008597
- Publication date Jan 8, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer with...
- Publication number 20140252654
- Publication date Sep 11, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20140246779
- Publication date Sep 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Protective Structure Around Semiconductor...
- Publication number 20140084424
- Publication date Mar 27, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Wider than Contact P...
- Publication number 20130249111
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20130175696
- Publication date Jul 11, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSE...
- Publication number 20130113092
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Substration...
- Publication number 20130075936
- Publication date Mar 28, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer with...
- Publication number 20130056879
- Publication date Mar 7, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20120199965
- Publication date Aug 9, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20120112340
- Publication date May 10, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Structure Aro...
- Publication number 20120074534
- Publication date Mar 29, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Wider than Contact P...
- Publication number 20120018904
- Publication date Jan 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming RDL over Contact Pad wit...
- Publication number 20120018874
- Publication date Jan 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Around...
- Publication number 20110221041
- Publication date Sep 15, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer with...
- Publication number 20110221055
- Publication date Sep 15, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20110221057
- Publication date Sep 15, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming interconnect substrate f...

Semiconductor device and method of forming sacrificial protective l...

Semiconductor device with dummy metal protective structure around s...

Semiconductor device and method of forming repassivation layer for...

Semiconductor device and method of forming interconnect substrate f...

Semiconductor device and method of forming sacrificial protective l...

Semiconductor device and method of forming repassivation layer for...

Semiconductor device and method of forming repassivation layer with...

Semiconductor device and method of forming RDL over contact pad wit...

Semiconductor device and method of forming insulating layer dispose...

Method of forming RDL wider than contact pad along first axis and n...

Semiconductor device and method of forming sacrificial protective l...

Semiconductor device and method of forming repassivation layer with...

Semiconductor device and method of forming protective structure aro...

Semiconductor device and method of forming RDL wider than contact p...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device and method of forming insulating layer around...

Semiconductor device and method of forming repassivation layer with...

Semiconductor device and method of forming sacrificial protective l...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Interconnect Substrate f...

Semiconductor Device and Method of Forming Sacrificial Protective L...

Semiconductor Device and Method of Forming Repassivation Layer for...

Semiconductor Device and Method of Forming Repassivation Layer for...

Semiconductor Device and Method of Forming Sacrificial Protective L...

Semiconductor Device and Method of Forming Repassivation Layer with...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device with Protective Structure Around Semiconductor...

Semiconductor Device and Method of Forming RDL Wider than Contact P...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSE...

Semiconductor Device and Method of Forming Interconnect Substration...

Semiconductor Device and Method of Forming Repassivation Layer with...

Semiconductor Device and Method of Forming Sacrificial Protective L...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device and Method of Forming Protective Structure Aro...

Semiconductor Device and Method of Forming RDL Wider than Contact P...

Semiconductor Device and Method of Forming RDL over Contact Pad wit...

Semiconductor Device and Method of Forming Insulating Layer Around...

Semiconductor Device and Method of Forming Repassivation Layer with...

Semiconductor Device and Method of Forming Sacrificial Protective L...