Xia Feng

Follow

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,666,500
- Issue date May 30, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer around...
- Patent number 9,437,552
- Issue date Sep 6, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method of manufacturing the same
- Patent number 9,368,538
- Issue date Jun 14, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- HaiFang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer around...
- Patent number 8,878,359
- Issue date Nov 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,759,155
- Issue date Jun 24, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160093656
- Publication date Mar 31, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- HaiFang ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20150228552
- Publication date Aug 13, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Around...
- Publication number 20140339683
- Publication date Nov 20, 2014
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Around...
- Publication number 20130147019
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS