Xia Li

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective etch for uniform metal trace exposure and milling using f...
- Patent number 7,029,595
- Issue date Apr 18, 2006
- Advanced Micro Devices, Inc.
- Xia (Susan) Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for backside device analysis on a ball grid array...
- Patent number 6,677,169
- Issue date Jan 13, 2004
- Advanced Micro Devices, Inc.
- Xia Li
- G01 - MEASURING TESTING
Information Patent Grant
Method and system to reduce switching signal noise on a device and...
- Patent number 6,521,486
- Issue date Feb 18, 2003
- Advanced Micro Devices, Inc.
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic decapsulation system utilizing an integrated spacer/prote...
- Patent number 6,517,666
- Issue date Feb 11, 2003
- Advanced Micro Devices, Inc.
- Xia Li
- G01 - MEASURING TESTING
Information Patent Grant
Automatic decapsulation system utilizing an acid resistant, high he...
- Patent number 6,409,878
- Issue date Jun 25, 2002
- Advanced Micro Devices, Inc.
- Xia Li
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for sealing the edge of a PBGA package
- Patent number 6,324,756
- Issue date Dec 4, 2001
- Advanced Micro Devices, Inc.
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system for frontside navigation and access of multi-laye...
- Patent number 6,262,430
- Issue date Jul 17, 2001
- Advanced Micro Devices, Inc.
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing a package for decapsulating a chip-...
- Patent number 6,241,907
- Issue date Jun 5, 2001
- Advanced Micro Devices, Inc.
- Ranjit Gannamani
- G01 - MEASURING TESTING
Information Patent Grant
Method for bringing up lower level metal nodes of multi-layered int...
- Patent number 6,171,944
- Issue date Jan 9, 2001
- Advanced Micro Devices, Inc.
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside device deprocessing of a flip-chip multi-layer integrated...
- Patent number 6,168,960
- Issue date Jan 2, 2001
- Advanced Micro Devices, Inc.
- Xia Li
- G01 - MEASURING TESTING
Information Patent Grant
Backside exposure of desired nodes in a multi-layer integrated circuit
- Patent number 6,147,399
- Issue date Nov 14, 2000
- Advanced Micro Devices, Inc.
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposure of desired node in a multi-layer integrated circuit using...
- Patent number 6,069,079
- Issue date May 30, 2000
- Advanced Micro Devices, Inc.
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Automatic decapsulation system utilizing an integrated spacer/prote...
- Publication number 20020139768
- Publication date Oct 3, 2002
- Xia Li
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Selective etch for uniform metal trace exposure and milling using f...

Method and system for backside device analysis on a ball grid array...

Method and system to reduce switching signal noise on a device and...

Automatic decapsulation system utilizing an integrated spacer/prote...

Automatic decapsulation system utilizing an acid resistant, high he...

Method and system for sealing the edge of a PBGA package

Integrated system for frontside navigation and access of multi-laye...

Method and system for providing a package for decapsulating a chip-...

Method for bringing up lower level metal nodes of multi-layered int...

Backside device deprocessing of a flip-chip multi-layer integrated...

Backside exposure of desired nodes in a multi-layer integrated circuit

Exposure of desired node in a multi-layer integrated circuit using...

Patents Applicationslast 30 patents

Automatic decapsulation system utilizing an integrated spacer/prote...