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Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT WATER-LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20230282531
- Publication date Sep 7, 2023
- JCET Advanced Packaging Co., LTD.
- XIA XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
- Publication number 20230068875
- Publication date Mar 2, 2023
- JCET Advanced Packaging Co., LTD.
- HONG XU
- H01 - BASIC ELECTRIC ELEMENTS