Xiang Dai

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Roseville, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Supporting a circuit package including a substrate having a solder...
- Patent number 7,372,147
- Issue date May 13, 2008
- Hewlett-Packard Development Company, L.P.
- Xiang Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support for an integrated circuit package having a column grid arra...
- Patent number 6,923,658
- Issue date Aug 2, 2005
- Hewlett-Packard Development Company, L.P.
- Dan Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for aligning a component on a printed circuit board
- Publication number 20060156540
- Publication date Jul 20, 2006
- Hewlett-Packard Development Company, L.P.
- Daniel Cromwell
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SUPPORT FOR AN INTEGRATED CIRCUIT PACKAGE HAVING A COLUMN GRID ARRA...
- Publication number 20050124185
- Publication date Jun 9, 2005
- Dan Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Supporting a circuit package including a substrate having a solder...
- Publication number 20050001310
- Publication date Jan 6, 2005
- Xiang Dai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Protective coating for attach hardware for circuits
- Publication number 20040240188
- Publication date Dec 2, 2004
- Stephen Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of perimeter stops to support solder interconnects between inte...
- Publication number 20040134680
- Publication date Jul 15, 2004
- Xiang Dai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...